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AiP technology is an antenna packaging solution that implements an antenna or antennas in an IC package that can carry a bare RF chip (transceiver)...
Catalog: 
MRRPB5
March 2024
Price: USD 2,900.00
Photosensitive Polyimide is a photo-sensitive composite used in the last semiconductor process and is a buffer coating material with electrical...
MRRPB5
February 2024
Price: USD 2,900.00
The global Ceramic Packages market was valued at US$ 2840.1 million in 2023 and is anticipated to reach US$ 4122 million by 2030, witnessing a CAGR...
Catalog: 
MRRPB5
January 2024
Price: USD 2,900.00
The key drivers for the growth of the LED packaging market include increasing demand for high power grade LED packages for lighting applications;...
MRRPB5
February 2024
Price: USD 2,900.00
The Electronic Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions),...
MRRPB5
January 2024
Price: USD 2,900.00
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete...
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MRRPB5
February 2024
Price: USD 2,900.00
System on package (SOP) refers to technology that places an entire system with computing, communications, and consumer functions all in a single chip...
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MRRPB5
February 2024
Price: USD 2,900.00
Metal has been used in electronic packaging earlier because of its good mechanical strength, good thermal conductivity, electromagnetic shielding...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Electronic chemicals for packaging market was valued at US$ 889.7 million in 2023 and is anticipated to reach US$ 1433.4 million by 2030,...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
Thin film ceramic substrates, mainly covers the Alumina thin film substrates, and AlN thin film substrates. The global Thin Film Ceramic Substrates...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global SMD Ceramic Packaging market was valued at US$ 52410 million in 2023 and is anticipated to reach US$ 84550 million by 2030, witnessing a...
MRRPB5
February 2024
Price: USD 2,900.00
Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global Transistor Outline (TO) Package market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00

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