A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits (ICs or "chips"), semiconductor dies and or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.
The global Multi-chip Module (MCM) Packaging market is projected to reach US$ 409.3 million in 2029, increasing from US$ 287.5 million in 2022, with the CAGR of 4.1% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Multi-chip Module (MCM) Packaging market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Multi-chip Module (MCM) Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Cypress
Samsung
Micron Technology
Winbond
Macronix
ISSI
Eon
Microchip
SK Hynix
Intel
Texas Instruments
ASE
Amkor
IBM
Qorvo
Segment by Type
MCM-D
MCM-C
MCM-L
Segment by Application
PC
SSD
Consumer Electronics
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Multi-chip Module (MCM) Packaging report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
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1 Multi-chip Module (MCM) Packaging Market Overview
1.1 Product Definition
1.2 Multi-chip Module (MCM) Packaging Segment by Type
1.2.1 Global Multi-chip Module (MCM) Packaging Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 MCM-D
1.2.3 MCM-C
1.2.4 MCM-L
1.3 Multi-chip Module (MCM) Packaging Segment by Application
1.3.1 Global Multi-chip Module (MCM) Packaging Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 PC
1.3.3 SSD
1.3.4 Consumer Electronics
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Multi-chip Module (MCM) Packaging Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Multi-chip Module (MCM) Packaging Production Estimates and Forecasts (2018-2029)
1.4.4 Global Multi-chip Module (MCM) Packaging Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Multi-chip Module (MCM) Packaging Production Market Share by Manufacturers (2018-2023)
2.2 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Multi-chip Module (MCM) Packaging, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Multi-chip Module (MCM) Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Multi-chip Module (MCM) Packaging Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Multi-chip Module (MCM) Packaging, Date of Enter into This Industry
2.9 Multi-chip Module (MCM) Packaging Market Competitive Situation and Trends
2.9.1 Multi-chip Module (MCM) Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Multi-chip Module (MCM) Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Multi-chip Module (MCM) Packaging Production by Region
3.1 Global Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Multi-chip Module (MCM) Packaging Production Value by Region (2018-2029)
3.2.1 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Multi-chip Module (MCM) Packaging by Region (2024-2029)
3.3 Global Multi-chip Module (MCM) Packaging Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Multi-chip Module (MCM) Packaging Production by Region (2018-2029)
3.4.1 Global Multi-chip Module (MCM) Packaging Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Multi-chip Module (MCM) Packaging by Region (2024-2029)
3.5 Global Multi-chip Module (MCM) Packaging Market Price Analysis by Region (2018-2023)
3.6 Global Multi-chip Module (MCM) Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Multi-chip Module (MCM) Packaging Production Value Estimates and Forecasts (2018-2029)
4 Multi-chip Module (MCM) Packaging Consumption by Region
4.1 Global Multi-chip Module (MCM) Packaging Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Multi-chip Module (MCM) Packaging Consumption by Region (2018-2029)
4.2.1 Global Multi-chip Module (MCM) Packaging Consumption by Region (2018-2023)
4.2.2 Global Multi-chip Module (MCM) Packaging Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Multi-chip Module (MCM) Packaging Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Multi-chip Module (MCM) Packaging Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Multi-chip Module (MCM) Packaging Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Multi-chip Module (MCM) Packaging Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Multi-chip Module (MCM) Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Multi-chip Module (MCM) Packaging Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Multi-chip Module (MCM) Packaging Production by Type (2018-2029)
5.1.1 Global Multi-chip Module (MCM) Packaging Production by Type (2018-2023)
5.1.2 Global Multi-chip Module (MCM) Packaging Production by Type (2024-2029)
5.1.3 Global Multi-chip Module (MCM) Packaging Production Market Share by Type (2018-2029)
5.2 Global Multi-chip Module (MCM) Packaging Production Value by Type (2018-2029)
5.2.1 Global Multi-chip Module (MCM) Packaging Production Value by Type (2018-2023)
5.2.2 Global Multi-chip Module (MCM) Packaging Production Value by Type (2024-2029)
5.2.3 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Type (2018-2029)
5.3 Global Multi-chip Module (MCM) Packaging Price by Type (2018-2029)
6 Segment by Application
6.1 Global Multi-chip Module (MCM) Packaging Production by Application (2018-2029)
6.1.1 Global Multi-chip Module (MCM) Packaging Production by Application (2018-2023)
6.1.2 Global Multi-chip Module (MCM) Packaging Production by Application (2024-2029)
6.1.3 Global Multi-chip Module (MCM) Packaging Production Market Share by Application (2018-2029)
6.2 Global Multi-chip Module (MCM) Packaging Production Value by Application (2018-2029)
6.2.1 Global Multi-chip Module (MCM) Packaging Production Value by Application (2018-2023)
6.2.2 Global Multi-chip Module (MCM) Packaging Production Value by Application (2024-2029)
6.2.3 Global Multi-chip Module (MCM) Packaging Production Value Market Share by Application (2018-2029)
6.3 Global Multi-chip Module (MCM) Packaging Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Cypress
7.1.1 Cypress Multi-chip Module (MCM) Packaging Corporation Information
7.1.2 Cypress Multi-chip Module (MCM) Packaging Product Portfolio
7.1.3 Cypress Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Cypress Main Business and Markets Served
7.1.5 Cypress Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Multi-chip Module (MCM) Packaging Corporation Information
7.2.2 Samsung Multi-chip Module (MCM) Packaging Product Portfolio
7.2.3 Samsung Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 Micron Technology
7.3.1 Micron Technology Multi-chip Module (MCM) Packaging Corporation Information
7.3.2 Micron Technology Multi-chip Module (MCM) Packaging Product Portfolio
7.3.3 Micron Technology Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Micron Technology Main Business and Markets Served
7.3.5 Micron Technology Recent Developments/Updates
7.4 Winbond
7.4.1 Winbond Multi-chip Module (MCM) Packaging Corporation Information
7.4.2 Winbond Multi-chip Module (MCM) Packaging Product Portfolio
7.4.3 Winbond Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Winbond Main Business and Markets Served
7.4.5 Winbond Recent Developments/Updates
7.5 Macronix
7.5.1 Macronix Multi-chip Module (MCM) Packaging Corporation Information
7.5.2 Macronix Multi-chip Module (MCM) Packaging Product Portfolio
7.5.3 Macronix Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Macronix Main Business and Markets Served
7.5.5 Macronix Recent Developments/Updates
7.6 ISSI
7.6.1 ISSI Multi-chip Module (MCM) Packaging Corporation Information
7.6.2 ISSI Multi-chip Module (MCM) Packaging Product Portfolio
7.6.3 ISSI Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.6.4 ISSI Main Business and Markets Served
7.6.5 ISSI Recent Developments/Updates
7.7 Eon
7.7.1 Eon Multi-chip Module (MCM) Packaging Corporation Information
7.7.2 Eon Multi-chip Module (MCM) Packaging Product Portfolio
7.7.3 Eon Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Eon Main Business and Markets Served
7.7.5 Eon Recent Developments/Updates
7.8 Microchip
7.8.1 Microchip Multi-chip Module (MCM) Packaging Corporation Information
7.8.2 Microchip Multi-chip Module (MCM) Packaging Product Portfolio
7.8.3 Microchip Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Microchip Main Business and Markets Served
7.7.5 Microchip Recent Developments/Updates
7.9 SK Hynix
7.9.1 SK Hynix Multi-chip Module (MCM) Packaging Corporation Information
7.9.2 SK Hynix Multi-chip Module (MCM) Packaging Product Portfolio
7.9.3 SK Hynix Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.9.4 SK Hynix Main Business and Markets Served
7.9.5 SK Hynix Recent Developments/Updates
7.10 Intel
7.10.1 Intel Multi-chip Module (MCM) Packaging Corporation Information
7.10.2 Intel Multi-chip Module (MCM) Packaging Product Portfolio
7.10.3 Intel Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Intel Main Business and Markets Served
7.10.5 Intel Recent Developments/Updates
7.11 Texas Instruments
7.11.1 Texas Instruments Multi-chip Module (MCM) Packaging Corporation Information
7.11.2 Texas Instruments Multi-chip Module (MCM) Packaging Product Portfolio
7.11.3 Texas Instruments Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Texas Instruments Main Business and Markets Served
7.11.5 Texas Instruments Recent Developments/Updates
7.12 ASE
7.12.1 ASE Multi-chip Module (MCM) Packaging Corporation Information
7.12.2 ASE Multi-chip Module (MCM) Packaging Product Portfolio
7.12.3 ASE Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.12.4 ASE Main Business and Markets Served
7.12.5 ASE Recent Developments/Updates
7.13 Amkor
7.13.1 Amkor Multi-chip Module (MCM) Packaging Corporation Information
7.13.2 Amkor Multi-chip Module (MCM) Packaging Product Portfolio
7.13.3 Amkor Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Amkor Main Business and Markets Served
7.13.5 Amkor Recent Developments/Updates
7.14 IBM
7.14.1 IBM Multi-chip Module (MCM) Packaging Corporation Information
7.14.2 IBM Multi-chip Module (MCM) Packaging Product Portfolio
7.14.3 IBM Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.14.4 IBM Main Business and Markets Served
7.14.5 IBM Recent Developments/Updates
7.15 Qorvo
7.15.1 Qorvo Multi-chip Module (MCM) Packaging Corporation Information
7.15.2 Qorvo Multi-chip Module (MCM) Packaging Product Portfolio
7.15.3 Qorvo Multi-chip Module (MCM) Packaging Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Qorvo Main Business and Markets Served
7.15.5 Qorvo Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Multi-chip Module (MCM) Packaging Industry Chain Analysis
8.2 Multi-chip Module (MCM) Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Multi-chip Module (MCM) Packaging Production Mode & Process
8.4 Multi-chip Module (MCM) Packaging Sales and Marketing
8.4.1 Multi-chip Module (MCM) Packaging Sales Channels
8.4.2 Multi-chip Module (MCM) Packaging Distributors
8.5 Multi-chip Module (MCM) Packaging Customers
9 Multi-chip Module (MCM) Packaging Market Dynamics
9.1 Multi-chip Module (MCM) Packaging Industry Trends
9.2 Multi-chip Module (MCM) Packaging Market Drivers
9.3 Multi-chip Module (MCM) Packaging Market Challenges
9.4 Multi-chip Module (MCM) Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Cypress
Samsung
Micron Technology
Winbond
Macronix
ISSI
Eon
Microchip
SK Hynix
Intel
Texas Instruments
ASE
Amkor
IBM
Qorvo
*If Applicable.