Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing tape include Non-UV Tape and UV Tape. Non-UV type refers to the general traditional pressure-sensitive adhesive tape. Considering the ease of peeling, its adhesive force is generally lower than that of UV type (before UV exposure), which is about 100~400 gf/25mm. UV tape is a pressure-sensitive tape with high adhesive strength before exposure, and its peel force will be greatly reduced after exposure to UV light. Wafer back grinding tape (BG Tape) mainly refers to the protection and fixation of the front circuit of the wafer when the back grinding is thinned after the wafer is manufactured, and prevents damage to the front circuit of the wafer during the back grinding of the wafer. The dicing tape (Dicing Tape) is mainly used for fixing, dicing, expansion, UV debonding, separation, etc. in the semiconductor wafer and packaging process.
The global Wafer Thinning and Dicing Film market is projected to reach US$ 1275.8 million in 2029, increasing from US$ 1021 million in 2022, with the CAGR of 3.3% during the period of 2023 to 2029.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Thinning and Dicing Film market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
Segment by Type
UV Film
Non-UV Film
Segment by Application
Back Grinding
Wafer Dicing
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Wafer Thinning and Dicing Film report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
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1 Wafer Thinning and Dicing Film Market Overview
1.1 Product Definition
1.2 Wafer Thinning and Dicing Film Segment by Type
1.2.1 Global Wafer Thinning and Dicing Film Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 UV Film
1.2.3 Non-UV Film
1.3 Wafer Thinning and Dicing Film Segment by Application
1.3.1 Global Wafer Thinning and Dicing Film Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Back Grinding
1.3.3 Wafer Dicing
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Thinning and Dicing Film Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Thinning and Dicing Film Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Thinning and Dicing Film Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Thinning and Dicing Film Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Thinning and Dicing Film Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Thinning and Dicing Film Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Thinning and Dicing Film, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Thinning and Dicing Film Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Thinning and Dicing Film Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Thinning and Dicing Film, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Thinning and Dicing Film, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Thinning and Dicing Film, Date of Enter into This Industry
2.9 Wafer Thinning and Dicing Film Market Competitive Situation and Trends
2.9.1 Wafer Thinning and Dicing Film Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Thinning and Dicing Film Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Thinning and Dicing Film Production by Region
3.1 Global Wafer Thinning and Dicing Film Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Thinning and Dicing Film Production Value by Region (2018-2029)
3.2.1 Global Wafer Thinning and Dicing Film Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Thinning and Dicing Film by Region (2024-2029)
3.3 Global Wafer Thinning and Dicing Film Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Thinning and Dicing Film Production by Region (2018-2029)
3.4.1 Global Wafer Thinning and Dicing Film Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Thinning and Dicing Film by Region (2024-2029)
3.5 Global Wafer Thinning and Dicing Film Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Thinning and Dicing Film Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Thinning and Dicing Film Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Thinning and Dicing Film Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Thinning and Dicing Film Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Thinning and Dicing Film Production Value Estimates and Forecasts (2018-2029)
4 Wafer Thinning and Dicing Film Consumption by Region
4.1 Global Wafer Thinning and Dicing Film Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Thinning and Dicing Film Consumption by Region (2018-2029)
4.2.1 Global Wafer Thinning and Dicing Film Consumption by Region (2018-2023)
4.2.2 Global Wafer Thinning and Dicing Film Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Thinning and Dicing Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Thinning and Dicing Film Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Thinning and Dicing Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Thinning and Dicing Film Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Thinning and Dicing Film Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Thinning and Dicing Film Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Thinning and Dicing Film Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Thinning and Dicing Film Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Thinning and Dicing Film Production by Type (2018-2029)
5.1.1 Global Wafer Thinning and Dicing Film Production by Type (2018-2023)
5.1.2 Global Wafer Thinning and Dicing Film Production by Type (2024-2029)
5.1.3 Global Wafer Thinning and Dicing Film Production Market Share by Type (2018-2029)
5.2 Global Wafer Thinning and Dicing Film Production Value by Type (2018-2029)
5.2.1 Global Wafer Thinning and Dicing Film Production Value by Type (2018-2023)
5.2.2 Global Wafer Thinning and Dicing Film Production Value by Type (2024-2029)
5.2.3 Global Wafer Thinning and Dicing Film Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Thinning and Dicing Film Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Thinning and Dicing Film Production by Application (2018-2029)
6.1.1 Global Wafer Thinning and Dicing Film Production by Application (2018-2023)
6.1.2 Global Wafer Thinning and Dicing Film Production by Application (2024-2029)
6.1.3 Global Wafer Thinning and Dicing Film Production Market Share by Application (2018-2029)
6.2 Global Wafer Thinning and Dicing Film Production Value by Application (2018-2029)
6.2.1 Global Wafer Thinning and Dicing Film Production Value by Application (2018-2023)
6.2.2 Global Wafer Thinning and Dicing Film Production Value by Application (2024-2029)
6.2.3 Global Wafer Thinning and Dicing Film Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Thinning and Dicing Film Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Mitsui Chemicals Tohcello
7.1.1 Mitsui Chemicals Tohcello Wafer Thinning and Dicing Film Corporation Information
7.1.2 Mitsui Chemicals Tohcello Wafer Thinning and Dicing Film Product Portfolio
7.1.3 Mitsui Chemicals Tohcello Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Mitsui Chemicals Tohcello Main Business and Markets Served
7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
7.2 LINTEC
7.2.1 LINTEC Wafer Thinning and Dicing Film Corporation Information
7.2.2 LINTEC Wafer Thinning and Dicing Film Product Portfolio
7.2.3 LINTEC Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.2.4 LINTEC Main Business and Markets Served
7.2.5 LINTEC Recent Developments/Updates
7.3 Denka
7.3.1 Denka Wafer Thinning and Dicing Film Corporation Information
7.3.2 Denka Wafer Thinning and Dicing Film Product Portfolio
7.3.3 Denka Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Denka Main Business and Markets Served
7.3.5 Denka Recent Developments/Updates
7.4 Nitto
7.4.1 Nitto Wafer Thinning and Dicing Film Corporation Information
7.4.2 Nitto Wafer Thinning and Dicing Film Product Portfolio
7.4.3 Nitto Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Nitto Main Business and Markets Served
7.4.5 Nitto Recent Developments/Updates
7.5 Furukawa Electric
7.5.1 Furukawa Electric Wafer Thinning and Dicing Film Corporation Information
7.5.2 Furukawa Electric Wafer Thinning and Dicing Film Product Portfolio
7.5.3 Furukawa Electric Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Furukawa Electric Main Business and Markets Served
7.5.5 Furukawa Electric Recent Developments/Updates
7.6 Sumitomo Bakelite
7.6.1 Sumitomo Bakelite Wafer Thinning and Dicing Film Corporation Information
7.6.2 Sumitomo Bakelite Wafer Thinning and Dicing Film Product Portfolio
7.6.3 Sumitomo Bakelite Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Sumitomo Bakelite Main Business and Markets Served
7.6.5 Sumitomo Bakelite Recent Developments/Updates
7.7 D&X
7.7.1 D&X Wafer Thinning and Dicing Film Corporation Information
7.7.2 D&X Wafer Thinning and Dicing Film Product Portfolio
7.7.3 D&X Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.7.4 D&X Main Business and Markets Served
7.7.5 D&X Recent Developments/Updates
7.8 AI Technology
7.8.1 AI Technology Wafer Thinning and Dicing Film Corporation Information
7.8.2 AI Technology Wafer Thinning and Dicing Film Product Portfolio
7.8.3 AI Technology Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.8.4 AI Technology Main Business and Markets Served
7.7.5 AI Technology Recent Developments/Updates
7.9 ULTRON SYSTEM
7.9.1 ULTRON SYSTEM Wafer Thinning and Dicing Film Corporation Information
7.9.2 ULTRON SYSTEM Wafer Thinning and Dicing Film Product Portfolio
7.9.3 ULTRON SYSTEM Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.9.4 ULTRON SYSTEM Main Business and Markets Served
7.9.5 ULTRON SYSTEM Recent Developments/Updates
7.10 maxell
7.10.1 maxell Wafer Thinning and Dicing Film Corporation Information
7.10.2 maxell Wafer Thinning and Dicing Film Product Portfolio
7.10.3 maxell Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.10.4 maxell Main Business and Markets Served
7.10.5 maxell Recent Developments/Updates
7.11 NDS
7.11.1 NDS Wafer Thinning and Dicing Film Corporation Information
7.11.2 NDS Wafer Thinning and Dicing Film Product Portfolio
7.11.3 NDS Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.11.4 NDS Main Business and Markets Served
7.11.5 NDS Recent Developments/Updates
7.12 KGK Chemical
7.12.1 KGK Chemical Wafer Thinning and Dicing Film Corporation Information
7.12.2 KGK Chemical Wafer Thinning and Dicing Film Product Portfolio
7.12.3 KGK Chemical Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.12.4 KGK Chemical Main Business and Markets Served
7.12.5 KGK Chemical Recent Developments/Updates
7.13 NEXTECK
7.13.1 NEXTECK Wafer Thinning and Dicing Film Corporation Information
7.13.2 NEXTECK Wafer Thinning and Dicing Film Product Portfolio
7.13.3 NEXTECK Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.13.4 NEXTECK Main Business and Markets Served
7.13.5 NEXTECK Recent Developments/Updates
7.14 WISE new material
7.14.1 WISE new material Wafer Thinning and Dicing Film Corporation Information
7.14.2 WISE new material Wafer Thinning and Dicing Film Product Portfolio
7.14.3 WISE new material Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.14.4 WISE new material Main Business and Markets Served
7.14.5 WISE new material Recent Developments/Updates
7.15 Vistaic
7.15.1 Vistaic Wafer Thinning and Dicing Film Corporation Information
7.15.2 Vistaic Wafer Thinning and Dicing Film Product Portfolio
7.15.3 Vistaic Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Vistaic Main Business and Markets Served
7.15.5 Vistaic Recent Developments/Updates
7.16 Suzhou BoYan Jingjin Photoelectric
7.16.1 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing Film Corporation Information
7.16.2 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing Film Product Portfolio
7.16.3 Suzhou BoYan Jingjin Photoelectric Wafer Thinning and Dicing Film Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Suzhou BoYan Jingjin Photoelectric Main Business and Markets Served
7.16.5 Suzhou BoYan Jingjin Photoelectric Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Thinning and Dicing Film Industry Chain Analysis
8.2 Wafer Thinning and Dicing Film Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Thinning and Dicing Film Production Mode & Process
8.4 Wafer Thinning and Dicing Film Sales and Marketing
8.4.1 Wafer Thinning and Dicing Film Sales Channels
8.4.2 Wafer Thinning and Dicing Film Distributors
8.5 Wafer Thinning and Dicing Film Customers
9 Wafer Thinning and Dicing Film Market Dynamics
9.1 Wafer Thinning and Dicing Film Industry Trends
9.2 Wafer Thinning and Dicing Film Market Drivers
9.3 Wafer Thinning and Dicing Film Market Challenges
9.4 Wafer Thinning and Dicing Film Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Mitsui Chemicals Tohcello
LINTEC
Denka
Nitto
Furukawa Electric
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
maxell
NDS
KGK Chemical
NEXTECK
WISE new material
Vistaic
Suzhou BoYan Jingjin Photoelectric
*If Applicable.