0 items USD 0.00Search
Your search for "OSAT" gave back 668 results.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
The global Wafer Probe Station market size was valued at USD 1600 million in 2022 and is forecast to a readjusted size of USD 2305.9 million by 2029...
Catalog:
GIR
November 2023
Price: USD 3,480.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE →...
Catalog:
MRRPB5
January 2023
Price: USD 4,000.00
The global Fully Automatic Probe Stations market size was valued at USD 1303.7 million in 2023 and is forecast to a readjusted size of USD 1904...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Automotive Packaging market size was valued at USD 8674 million in 2022 and is forecast to a readjusted size of USD 15150 million by 2029...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Semiconductor Vacuum Tips market size was valued at USD 170.8 million in 2023 and is forecast to a readjusted size of USD 244.4 million by...
Catalog:
GIR
February 2024
Price: USD 3,480.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
The global Multifunctional Ball Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with...
Catalog:
GIR
September 2023
Price: USD 3,480.00
The global Multifunctional Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
September 2023
Price: USD 3,480.00
The global Thermosonic Ball Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
September 2023
Price: USD 3,480.00
The global Thermosonic Wire Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
September 2023
Price: USD 3,480.00
The global Fully Automatic Probe Stations market size was valued at USD 1303.7 million in 2022 and is forecast to a readjusted size of USD 1904...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Automotive Chip Packaging market size was valued at USD 8674 million in 2022 and is forecast to a readjusted size of USD 15150 million by...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Power Packaging for Automotive Semiconductors market size was valued at USD 1268.7 million in 2022 and is forecast to a readjusted size of...
Catalog:
GIR
November 2023
Price: USD 3,480.00
