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Your search for "OSAT" gave back 662 results.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog: 
MRRPB5
January 2024
Price: USD 2,900.00
The global TCB Bonder market size was valued at US$ 88 million in 2023. With growing demand in downstream market, the TCB Bonder is forecast to a...
Catalog: 
LPI
January 2024
Price: USD 3,660.00
The global Thermo Compression Bonder market size was valued at US$ 71 million in 2023. With growing demand in downstream market, the Thermo...
Catalog: 
LPI
January 2024
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog: 
MRRPB5
January 2023
Price: USD 4,000.00
The global Semiconductor Package Probe market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with...
Catalog: 
GIR
August 2023
Price: USD 3,480.00
The global Memory Semiconductor Packaging market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast...
Catalog: 
GIR
June 2023
Price: USD 4,480.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
Catalog: 
MRRPB5
January 2024
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog: 
MRRPB5
January 2024
Price: USD 2,900.00
The global Advanced Packaging Inspection Systems market size was valued at US$ 364.6 million in 2023. With growing demand in downstream market, the...
Catalog: 
LPI
January 2024
Price: USD 3,660.00
The global Flip Chip Bonder market size was valued at US$ 283.7 million in 2023. With growing demand in downstream market, the Flip Chip Bonder is...
Catalog: 
LPI
January 2024
Price: USD 3,660.00
The global Test Handler market size was valued at USD 1836.4 million in 2023 and is forecast to a readjusted size of USD 3818.7 million by 2030 with...
Catalog: 
GIR
January 2024
Price: USD 3,480.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog: 
MRRPB5
November 2023
Price: USD 4,350.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog: 
MRRPB5
November 2023
Price: USD 4,350.00
The global TCB Bonder market size was valued at US$ 88 million in 2022. With growing demand in downstream market and recovery from influence of COVID...
Catalog: 
LPI
July 2023
Price: USD 3,660.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog: 
LPI
January 2023
Price: USD 3,660.00

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