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Your search for "OSAT" gave back 667 results.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components...
Catalog:
MRRPB5
November 2023
Price: USD 2,900.00
Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components...
Catalog:
MRRPB5
November 2023
Price: USD 2,900.00
The global Spherical Lead Bonding Machine market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Ball Wire Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global Memory Semiconductor Packaging market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
Catalog:
GIR
June 2023
Price: USD 3,480.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
Catalog:
LPI
March 2023
Price: USD 3,660.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
Catalog:
LPI
March 2023
Price: USD 3,660.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE →...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
The global 200 mm Wafer Probing Machines market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
Catalog:
GIR
March 2024
Price: USD 3,480.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE →...
Catalog:
LPI
January 2023
Price: USD 3,660.00
