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Your search for "Compound Semiconductor" gave back 76552 results.
The global Epoxy Plastic Compound for Electronic Packaging market size is expected to reach $ 3676.5 million by 2030, rising at a market growth of 5...
Catalog:
GIR
March 2024
Price: USD 4,480.00
Summary HeyReport estimates that the Gallium Arsenide (GaAs) Wafers market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025,...
Catalog:
HYR
June 2021
Price: USD 2,000.00
Summary HeyReport estimates that the Gallium Arsenide (GaAs) Wafers market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025,...
Catalog:
HYR
January 2021
Price: USD 2,000.00
Gallium trichloride (GaCl3, gallium chloride) is the ideal precursor for gallium derivative compounds.gallium trichloride is the starting material...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global PBI Compounds market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of %...
Catalog:
GIR
December 2023
Price: USD 3,480.00
Gallium trichloride (GaCl3, gallium chloride) is the ideal precursor for gallium derivative compounds.gallium trichloride is the starting material...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
It is the core manufacturing material of the semiconductor thin film deposition process. It has high barriers and high growth. It is used in the...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
The global PEEK Compound market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Traditional epoxy molding compounds refer to standard epoxy resins used in the encapsulation and protection of electronic components and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global PVT High-purity Silicon Carbide Powder market size is expected to reach $ 149.3 million by 2029, rising at a market growth of 9.5% CAGR...
Catalog:
GIR
July 2023
Price: USD 4,480.00
Wafer level package epoxy molding compound is a specialized epoxy resin used in the packaging of semiconductor devices directly at the wafer level...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
High thermal conductive epoxy molding compound is a specialized epoxy resin with high thermal conductivity, used in semiconductor packaging to...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Polishing compounds are abrasive compounds consisting of polishing powder mixed with waxes and fats to form a cake or bar. They are used in a variety...
Catalog:
LPI
January 2023
Price: USD 3,660.00
The global Photoactive Compound (PAC) market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
