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Your search for "global research data services copper tube pipe market russia 2020 market size development" gave back 28528 results.
The “Tungsten Copper Heat Sink Industry Forecast” looks at past sales and reviews total world Tungsten Copper Heat Sink sales in 2022, providing a...
Catalog:
LPI
February 2023
Price: USD 3,660.00
The “Copper Pillar Flip Chip Industry Forecast” looks at past sales and reviews total world Copper Pillar Flip Chip sales in 2022, providing a...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Copper clad laminate is the basic material of the electronics industry and the main material for processing and manufacturing printed circuit boards...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Copper indium gallium selenide (CIGS) is a semiconductor material composed of copper, indium, gallium, and selenium. CIGS is a tetrahedrally bonded...
Catalog:
LPI
February 2023
Price: USD 3,660.00
AMB refers to active metal brazing and copper clad technology. As the name implies, it relies on active metal brazing to realize the high-temperature...
Catalog:
LPI
January 2023
Price: USD 3,660.00
The “Copper Clad Flexible Laminate Industry Forecast” looks at past sales and reviews total world Copper Clad Flexible Laminate sales in 2022,...
Catalog:
LPI
February 2023
Price: USD 3,660.00
In high frequency communication industry chain, such as high frequency copper clad products of upstream raw materials mainly include copper foil,...
Catalog:
LPI
March 2023
Price: USD 3,660.00
First discovered in 1852 and developed as a thin film deposition technique in 1920, sputtering targets are a physical vapor deposition mechanism—an...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Electroless Copper for Multi-Layered Boards is an autocatalytic redox reaction. First, it is treated with an activator to adsorb a layer of active...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Power electronics and circuits produce a lot of heat when they work. Heatsink materials help to eliminate chip heat, transferring it to other media...
Catalog:
LPI
March 2023
Price: USD 3,660.00
First discovered in 1852 and developed as a thin film deposition technique in 1920, sputtering targets are a physical vapor deposition mechanism—an...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Copper indium gallium (CIG) alloy sputtering targets, made from copper, indium and gallium, are used as an absorbing layer in CIGS thin film solar...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Publisher' newest research report, the “Copper Leadframe Substrate Industry Forecast” looks at past sales and reviews total world Copper...
Catalog:
LPI
January 2023
Price: USD 3,660.00
Copper pillars are terminals used to “flip-chip” IC chips to a substrate in a semiconductor package by TCFC (Thermal Compression Flip-Chip)...
Catalog:
LPI
January 2023
Price: USD 3,660.00
Rigid copper clad laminate is a plate-like material formed by impregnating the reinforcing material with resin and hot pressing copper clad foils on...
Catalog:
LPI
February 2023
Price: USD 3,660.00
