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Your search for "technavio global automotive mems market 2015 2019" gave back 203943 results.
MEMS solder has a series of advantages such as high tensile strength, corrosion resistance, excellent thermal creep properties, compatibility with...
Catalog:
MRRPB5
February 2023
Price: USD 2,900.00
MEMS solder has a series of advantages such as high tensile strength, corrosion resistance, excellent thermal creep properties, compatibility with...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
The global Thick Film Ceramic Substrates market size was valued at USD 102.9 million in 2023 and is forecast to a readjusted size of USD 132.1...
Catalog:
GIR
January 2024
Price: USD 3,480.00
Thick film ceramic substrate refers to ceramic substrate processed by thick film technology. The thick film ceramic substrate is a post-fired ceramic...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Multilayer Ceramic Packages market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Epitaxy is the process of depositing a crystalline layer over a crystalline-based semiconductor substrate or surface. Epitaxial devices comprise...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
The global Electronic Grade Tetraethyl Orthosilicate (TEOS) market size was valued at USD 191.2 million in 2023 and is forecast to a readjusted size...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Metal Organic Chemical Vapor Deposition (MOCVD) market size was valued at USD 1001.2 million in 2023 and is forecast to a readjusted size...
Catalog:
GIR
January 2024
Price: USD 3,480.00
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Polymers are broadly classified on their molecular arrangement as amorphous or crystalline. In an amorphous polymer, the molecules are arranged in a...
Catalog:
MRRPB5
February 2023
Price: USD 2,900.00
The global Through Glass Via (TGV) Technology market size was valued at USD 51 million in 2023 and is forecast to a readjusted size of USD 227.2...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global market for Lift-off Resist was estimated to be worth US$ 288.54 million in 2023 and is forecast to a readjusted size of US$ 506.02 million...
Catalog:
MRRPB5
March 2024
Price: USD 3,950.00
The global Liquid Molding Compound in Wafer Level Pakaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
Tetraethyl Orthosilicate (TEOS), also known as tetraethoxysilane (TEOS), its chemical formula is Si(OC2H5)4. Electronic grade tetraethyl...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
Metalorganic vapour-phase epitaxy (MOVPE), also known as organometallic vapour-phase epitaxy (OMVPE) or metalorganic chemical vapour deposition (...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
