Global Advanced Packaging Market 2021-2031 by Product Type , Packaging Platform , End User , and Region: Trend Forecast and Growth OpportunityGlobal advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 79 tables and 74 figures, this 152-page report “Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources...Read more | USD 3,500.00 |
North America Advanced Packaging Market 2021-2031 by Product Type , Packaging Platform , End User , and Country: Trend Forecast and Growth OpportunityNorth America advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 20 tables and 38 figures, this 89-page report “North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium...Read more | USD 2,900.00 |
Europe Advanced Packaging Market 2021-2031 by Product Type , Packaging Platform , End User , and Country: Trend Forecast and Growth OpportunityEurope advanced packaging market was valued at $3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 30 tables and 42 figures, this 99-page report “Europe Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information...Read more | USD 2,900.00 |
Asia Pacific Advanced Packaging Market 2021-2031 by Product Type , Packaging Platform , End User , and Country: Trend Forecast and Growth OpportunityAsia Pacific advanced packaging market will grow by 10.7% annually with a total addressable market cap of $338.4 billion over 2022-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 27 tables and 41 figures, this 97-page report “Asia Pacific Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary...Read more | USD 2,900.00 |
Global Isothermal Packaging Market Growth 2022-2028As the global economy recovers in 2021 and the supply of the industrial chain improves, the Isothermal Packaging market will undergo major changes. According to the latest research, the market size of the Isothermal Packaging industry in 2021 will increase by USD million compared to 2020, with a growth rate of %. The global Isothermal Packaging industry report provides top-notch qualitative and quantitative information including: Market size (2017-2021 value and 2022 forecast). The report also contains descriptions of key players, including key financial indicators and market competitive pressure analysis. The report also assesses key opportunities in the market and outlines the factors that are and will drive the growth of the industry. Taking into account previous growth patterns, growth drivers, and current and future trends, we also forecast the overall growth of the global Isothermal Packaging market during the next few years. The global Isothermal Packaging...Read more | USD 3,490.00 |