0 items USD 0.00Trailblazers of the Advanced Substrate Market: The Top 10 Companies You Need to Know
The "Advanced Substrate" refers to the segment of the semiconductor and electronics industry that focuses on innovative substrate materials used in chip manufacturing. Substrates, the base material upon which devices or circuits are built (often silicon), have evolved with technology, incorporating new materials and techniques to improve performance, reduce power consumption, and enable new functionalities. Advanced substrates can include engineered substrates like SOI (Silicon On Insulator), compound semiconductors (e.g., GaN, SiC), and emerging materials (e.g., graphene, 2D materials).
Advanced Substrate Market Size
The value of the Global Semiconductor Advanced Substrate market is expected to grow from $8.2 billion in 2022 to $13 billion by 2029.
Advanced semiconductor packaging has evolved significantly, introducing technologies like FC BGA (Flip Chip Ball Grid Array) and Embedded Die, to meet the demands for higher performance, lower power semiconductors. These technologies facilitate the integration of multiple chips into a single package, enhancing chip performance and efficiency, crucial for applications such as 5G, autonomous vehicles, and IoT devices. FC BGA utilizes flip-chip technology to connect the silicon die to the package substrate, offering a compact form factor and high signal-propagation rate. Embedded Die packaging, on the other hand, embeds the die within the substrate itself, improving thermal management and electrical performance.
The semiconductor industry is witnessing significant advancements in substrate technologies to meet the growing demand for more powerful computing capabilities. Intel, for example, has unveiled its industry-leading glass substrates, which offer distinct advantages such as ultra-low flatness, better thermal and mechanical stability, resulting in higher interconnect density. This innovation enables the creation of high-density, high-performance chip packages, crucial for data-intensive workloads like artificial intelligence (AI). Intel's efforts in advancing glass substrate solutions aim to push the boundaries of Moore's Law beyond 2030, offering a 10x increase in interconnect density and the potential to scale up to 1 trillion transistors on a package by 2030.
On another front, Advanced Substrate Technologies (AST), a Singapore-based subsidiary of TOPPAN, has started the construction of a new manufacturing facility to produce high-end FC-BGA substrates. This facility, AST's first outside of Japan, will cater to the needs for cutting-edge semiconductor products, leveraging design and manufacturing expertise to achieve high quality and production efficiency. AST's initiative is supported by Broadcom Inc. and is considered a significant addition to Singapore's semiconductor ecosystem, highlighting the country's strategic importance in the global semiconductor supply chain.
Furthermore, the U.S. Department of Defense (DoD) is also investing in advancing the nation's semiconductor packaging capabilities, with a $49m allocation to revitalize advanced semiconductor packaging. This investment aims to support the development and manufacturing of the Department’s weapon system and enable lower volume manufacturing commercial markets across the U.S. The funds are directed towards Micross, a native supplier of microelectronics, and the local government of Osceola County, Florida, showcasing a critical move to sustain and enhance the U.S. semiconductor manufacturing ecosystem.
These developments underline the strategic importance of advanced substrates and packaging technologies in the semiconductor industry, driving innovation and sustaining global competitiveness in the tech sector.
The Top 10 Companies in Advanced Substrate Segment
1 . ASE Group:
Advanced Semiconductor Engineering, Inc., also known as ASE Group is actively advancing in the field of semiconductor advanced substrates through several innovative packaging technologies and expansions of its production capabilities:
FOCoS Advancements under the VIPack™ Platform: ASE has introduced the industry’s first Fan-Out Chip on Substrate (FOCoS) packaging solutions, FOCoS-CF (Chip First with encapsulant-separated redistribution layer or RDL) and FOCoS-CL (Chip Last), which are designed to address the limitations of traditional flip-chip packages by enabling multi-chip and chiplet integration. These technologies offer improved Chip Package Interaction (CPI), reduced mechanical stress risk, and enhanced high-frequency signal integrity. FOCoS packaging technology is especially effective for High Bandwidth Memory (HBM) integration, crucial for high-performance computing, server, and networking markets, providing significant performance and footprint advantages.
VIPack™ for AI Devices: ASE's VIPack™ platform has been extended to meet the demand for complex chiplet integration for AI applications. This includes advancing chip-on-wafer interconnect pitch capabilities through micro bump technology, facilitating high-density chiplet integration. Such technological advancements enable innovative and scalable solutions for 2D, 2.5D, and 3D packaging, crucial for AI, mobile AP, microcontrollers, and other applications. ASE's micro bump technology significantly enhances silicon-to-silicon interconnects, supporting the integration of different chiplets or IP blocks within a single package, thus enabling more efficient and cost-effective semiconductor designs.
Expansion of Production for AI Chips: ASE is also expanding its production capabilities specifically targeting the advanced packaging of AI chips. This includes leasing additional plant space in Kaohsiung, Taiwan, to optimize space utilization and expand packaging capacity. The focus is on enhancing production for advanced packaging technologies, such as Fan-Out packaging, System-in-Package (SiP), wafer bumping, and FlipChip packaging. These technologies are applicable across various sectors, including automotive, IoT, high-speed computing, and artificial intelligence. Moreover, ASE's Kaohsiung plant is adopting smart plant initiatives, focusing on high-end processes to cater to the evolving demands of the semiconductor industry
2 . Unimicron Technology Corporation
Based in Taiwan, Unimicron Technology Corporation is a leader in the printed circuit board (PCB) industry, specializing in a range of products from standard PCBs to complex high-density interconnection (HDI) boards, and flexible to rigid-flex PCBs. The company is at the forefront of advanced substrate technology development, pushing the boundaries with Heterogeneous Integration technology and securing its innovations with multiple patents. This proactive approach underlines Unimicron's commitment to cementing its market leadership and boosting its competitive and value proposition.
Unimicron's product development and technological innovation are primarily focused on meeting and exceeding the current and next-generation needs of its customers. By aligning with international technology roadmaps and applying next-generation development of advanced technology, Unimicron aims to create intellectual property and establish a leading position with stable technologies. The company's research and development activities span across several key areas, including 5G high-frequency high-speed PCB products, ultra-small distance pitch LED module development, and high-end Photovia PCB technology development.
For PCB SBU, Unimicron is exploring technologies such as fine line process, Low Dk/Df dielectric material, and Copper filled via. The company has also made significant advancements in Rigid-Flex PCB, High Reliability Automobile PCB, Micro-LED PCB, Fine pitch Connector PCB, and NB HDI PCB. For the IC Carrier SBU, Unimicron is focusing on ultra-fine pitch circuit, ultra-fine bump pitch uball, Cu pillar technology, and coreless technology.
These initiatives reflect Unimicron's commitment to innovation, environmental sustainability, and meeting the evolving needs of the semiconductor and electronics industries. The company's dedication to research and development is evidenced by its significant annual investment in R&D, which amounts to about 1% of its annual revenue.
3 . Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp, headquartered in Taiwan, specializes in producing substrates and PCBs. The company is looking to expand its operations by potentially setting up a new manufacturing facility in Penang, Malaysia. This strategic move aims to bolster Kinsus's role as a crucial supplier to prominent clients like Nvidia and AMD, addressing the rising global demand for sophisticated substrate technologies essential for semiconductor production.
Kinsus offers a broad range of products, including SiP (System in Package), PBGA (Plastic Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), CSP (Chip Scale Package), RF modules, and FCBGA (Flip Chip Ball Grid Array). These products underline Kinsus's capabilities in providing advanced substrate solutions catering to various applications in the semiconductor industry.
The company has achieved significant milestones since its establishment, highlighting its growth and development in the semiconductor substrate market. Notable achievements include the purchase of the Youth Factory in 2021, establishing Fu-Yang Technology in 2016, starting the construction of the Xing-Feng Plant in 2014, and the merger with Piotek Computer in 2010, among others. These milestones reflect Kinsus's commitment to advancing its technology and expanding its manufacturing capabilities.
4 . TTM Technologies, Inc.
TTM Technologies, Inc. (TTM) stands as a global leader in delivering engineered systems, cutting-edge radio frequency (RF) components, assemblies, and advanced printed circuit boards (PCBs) designed for quick turnaround and high technology applications.
TTM Technologies has significantly expanded its capabilities in advanced substrate technology. In 2020, TTM opened a new Advanced Technology Center in Chippewa Falls, Wisconsin, strengthening its offerings in substrate-like technology. This state-of-the-art facility focuses on manufacturing some of the most advanced PCB solutions in North America, including substrate-like PCBs. The facility was established to meet the technical requirements of the products manufactured there, following cleanroom protocols throughout to ensure high yields.
TTM Technologies serves a wide array of markets, including aerospace & defense, automotive, computing, industrial & instrumentation, medical, networking and communications, and 5G. Their products are designed to meet the evolving needs of these industries, providing solutions that support advanced computing applications, safety and connectivity in automotive electronics, and the rapid deployment of 5G technologies, among others.
One of the innovative offerings from TTM is their Substrate-Like PCB (SLP) technology, which is particularly suited for applications requiring multi-layer, RF, and chip-on-flex requirements in markets such as aerospace, defense, space, medical, and telecommunications. Their HyperBGA® and CoreEZ® semiconductor packages exemplify TTM's commitment to delivering high-speed, reliable, and compact solutions. HyperBGA® utilizes a fluoropolymer-based coreless structure to support extremely high-speed signal transmission, while CoreEZ® offers a thin core build-up flip-chip package that enables high-density core vias for efficient signal layering on a cost-effective material set.
5 . AT&S: Advanced Technologies & Solutions
Since its founding in 1987, AT&S has evolved into a premier provider of advanced PCBs and IC substrates, integral to modern electronics from smartphones and computers to vehicles, industrial machinery, medical devices, and aerospace technology. AT&S plays a vital role in enhancing efficiency and promoting energy conservation across these applications.
AT&S is solidifying its position as a leading manufacturer of IC substrates and PCBs, especially in the realm of high-performance computing. The company has been recognized for providing IC substrates for AMD's data center processors and accelerators, marking a significant step in powering advanced digital experiences ranging from AI to VR. This collaboration not only emphasizes AT&S's commitment to delivering high-quality, energy-efficient solutions but also points to a broader trend of growth and innovation within the semiconductor industry.
AT&S's product offerings extend to a variety of advanced technologies tailored for high-performance applications. The company specializes in IC substrates for flip-chip applications, offering a crucial link between microchips and printed circuit boards. This connection technology is essential for the functionality of modern computers and other high-performance devices, highlighting AT&S's role in enabling the miniaturization and integration of complex semiconductor systems.
Furthermore, AT&S is actively engaged in developing future-oriented technologies and solutions across various sectors, including aerospace, automotive, medical, and 5G communications, among others. This broad spectrum of applications underlines the company's innovative spirit and its commitment to shaping a valuable future through advanced microelectronics. With facilities across the globe, including a notable presence in China, Malaysia, and Austria, AT&S is well-positioned to meet the growing demands of the semiconductor industry.
6 . Samsung
Samsung has been making strides in advanced substrate technology, particularly through its development of the Hybrid-Substrate Cube (H-Cube) technology. This 2.5D packaging solution is specialized for High-performance computing (HPC), AI, data centers, and network products that demand high-performance and large-area packaging technologies. H-Cube integrates advanced silicon interposer technology with a hybrid substrate structure, enabling the efficient integration of 6 high-bandwidth memories (HBMs), offering a cost-benefit advantage. This development was achieved in collaboration with Samsung Electro-Mechanics (SEMCO) and Amkor Technology, highlighting Samsung's commitment to expanding and enriching the foundry ecosystem to meet customer challenges.
Additionally, Samsung emphasizes the importance of Advanced Heterogeneous Integration in their semiconductor packaging. This approach unifies multiple chips into one system, enhancing power efficiency, adaptability, and simplifying production. Samsung’s packaging solutions, including I-Cube™ and H-Cube™ for 2.5D packaging, and X-Cube™ for 3D IC packaging, demonstrate their leadership in delivering advanced packaging technologies. These solutions enable higher performance, lower power consumption, and more efficient space usage, catering to the modern demands of semiconductor devices.
7 . LG Innotek
LG Innotek is at the forefront of advancing substrate technology, focusing on creating highly integrated and exceptionally thin substrates essential for semiconductor packaging. Their expertise in fine patterning and high-density ultra-thin substrates underlines their position as a leader in the market, with a range of products including RF-SiP, FCCSP, CSP, and AiP. These products demonstrate LG Innotek's capabilities in creating ultra-precision substrates and high-density materials essential for driving display devices and manufacturing panels, leveraging the world's leading fine patterning technology.
Furthermore, LG Innotek's participation in CES 2024 showcased their strong competencies in mobility and AI, featuring key electronic parts for future mobility, including advanced driver assistance systems (ADAS) camera modules, LiDAR, FC-BGA (Flip Chip-Ball Grid Array), and power components among others. Their exhibition highlighted the synergy of foundational technologies they've developed over the years in electronics, optical solutions, and substrate materials. Notably, their contributions to AI and 5G communication through substrates for Radio Frequency-System in Package (RF-SiP) and Antenna in-Package (AiP) were also displayed, emphasizing their role in supporting the advancement of AI with their high value-added substrate products.
8 . Ibiden Co., Ltd.
Ibiden Co., Ltd., based in Ogaki, Gifu Prefecture, Japan, specializes in the production of electronics components. Their product lineup includes advanced printed circuit boards and IC packaging, catering to the evolving needs of the electronics industry.
Ibiden is actively involved in the development of advanced packaging technologies, collaborating with industry leaders to push the boundaries of semiconductor performance and integration. They have been a key player in TSMC's 3DFabric Alliance, focusing on 3D silicon stacking and advanced packaging technologies. This initiative aims to enhance system-level innovations by offering improved performance, power efficiency, form factor, and functionality.
Moreover, Ibiden and TSMC have strengthened their collaboration in 3D packaging, aiming to boost the productivity of advanced package substrates significantly. Their participation in the TSMC 3DFabric Alliance and utilization of the 3Dblox standard specification highlight their commitment to overcoming the challenges of semiconductor package substrate manufacturing. This collaboration is set to improve the design and manufacturing process of semiconductor products, aiming for a tenfold increase in productivity through advanced 3D packaging technologies.
9 . Fujitsu Limited
Fujitsu Limited, a leading Japanese ICT corporation, is at the forefront of advancing substrate technology. The company has developed innovative cooling solutions to significantly boost the performance and dependability of semiconductor devices.
A significant development by Fujitsu Limited and Fujitsu Laboratories Ltd. is the world's first technology for bonding single-crystal diamond to silicon carbide (SiC) substrates at room temperature. This achievement is poised to significantly improve the performance of high-power devices like gallium nitride (GaN) high electron-mobility transistors (HEMTs), which are crucial for applications such as weather radars and wireless communications.
The unique bonding technique prevents the formation of a damaged layer that typically arises from the use of argon (Ar) beams during the manufacturing process, thereby enhancing the bonding strength between the diamond and SiC substrate. This innovation is expected to lower thermal resistance, enabling devices to operate at higher power levels while maintaining stability. The application of this technology is projected to extend the observable range of radar systems by approximately 1.5 times, offering significant improvements in weather monitoring and wireless communication capabilities.
10 . Kyocera Corporation
Kyocera Corporation, headquartered in Kyoto, Japan, is recognized globally for its innovative contributions to ceramics and electronics manufacturing. The company is at the forefront of developing advanced substrates, particularly focusing on crafting ceramic substrates that stand out for their exceptional rigidity and thermal stability.
These advanced ceramic substrates are designed to closely match the thermal expansion properties of silicon, addressing the challenges posed by the increasing size of integrated circuits and Si interposers. This innovation caters to the market's demand for stable and reliable components essential for high-performance computing and cloud services, where thermal management is critical.
Moreover, Kyocera is enhancing its semiconductor assembly capabilities within the United States. The company has expanded its semiconductor and microelectronic device assembly operations in San Diego, California, doubling assembly cleanroom space, tripling surface-mount component-attach capacity, and adding new technologies such as wafer laser-grooving and wafer-bumping capabilities. This expansion also includes the introduction of highly accurate bonding equipment, enabling advanced 2.5D and 3D packaging methodologies. These capabilities are part of Kyocera's comprehensive onshore semiconductor packaging and outsourced semiconductor assembly and testing (OSAT) services, aiming to support the U.S. semiconductor industry's demand for domestic complex assembly capabilities.
Kyocera also produces thick film substrates that cater to the increased density and precision of thick film circuits. These substrates, made from alumina, feature excellent reliability and are designed with tightly controlled dimensions and small through-holes to enable greater circuit density and precision. These substrates find applications in automotive parts, sensor parts, and general thick film applications, showcasing Kyocera's commitment to supporting a wide range of advanced electronic components with its innovative materials.
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