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Your search for "Bonding Wires" gave back 148 results.
The global Solder Alloy market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
Cyanoacrylate instant adhesives are one-component, low-viscosity liquids that cure rapidly with just contact pressure and surface moisture. They are...
Catalog:
MRRPB5
May 2024
Price: USD 2,900.00
The global Siallon Bonded Silicon Carbide Bricks market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing...
Catalog:
MRRPB5
May 2024
Price: USD 2,900.00
The global Nitride Bonded Silicon Carbide Materials market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
Catalog:
MRRPB5
May 2024
Price: USD 2,900.00
The global Corner & Edge Bonding Material market size is projected to grow from US$ million in 2023 to US$ million in 2030; it is expected to...
Catalog:
LPI
April 2024
Price: USD 3,660.00
The global Bricklaying Dry Mix Mortar and ALC Panel Bonding Mortar market size was valued at US$ million in 2023 and is forecast to a readjusted size...
Catalog:
GIR
May 2024
Price: USD 3,480.00
Two-component solvent-free acrylic structural adhesive is a type of adhesive comprised of two separate components that, when mixed together, form a...
Catalog:
GIR
April 2024
Price: USD 3,480.00
Two-component epoxy adhesive is a thermosetting resin adhesive that is cured after mixing two components (resin and hardener). It has excellent...
Catalog:
LPI
April 2024
Price: USD 3,660.00
The global UV Medical Device Adhesive market size was valued at US$ 387 million in 2023 and is forecast to a readjusted size of USD 512 million by...
Catalog:
GIR
May 2024
Price: USD 3,480.00
The global Industrial Use Sealant market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
Catalog:
GIR
April 2024
Price: USD 3,480.00
Low-temperature epoxy structural adhesive is an epoxy resin adhesive that cures under low-temperature conditions and has excellent bonding properties...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. The global Flip Chip Underfills...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
The global Hydrogen Fuel Cell Sealant market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
The global Semiconductor High Temperature Solder Paste market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
Catalog:
MRRPB5
May 2024
Price: USD 2,900.00
The global Solder Pastes for SMT market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
