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Your search for "Bonding Wires" gave back 24241 results.
The global Wire Bonder and Die Bonder market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
The global Heavy Wire Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Lead Alloy Solder Wire market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
June 2023
Price: USD 3,480.00
The global Wedge Bonding Tools market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR)...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
The global Lead Alloy Solder Wire market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR...
Catalog:
LPI
June 2023
Price: USD 3,660.00
The global Single Head Die Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period...
Catalog:
GIR
September 2023
Price: USD 4,480.00
The global Semiconductor Bonding Capillaries market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth...
Catalog:
MRRPB5
September 2023
Price: USD 4,900.00
The global Microelectronic Solder Wire market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate...
Catalog:
MRRPB5
September 2023
Price: USD 4,900.00
Microelectronic solder wire is composed of tin alloy and additives. The alloy components are divided into tin-lead and lead-free additives, which are...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Single-head die bonding machine is a kind of equipment used in the semiconductor packaging process, mainly used for fixing and welding the connecting...
Catalog:
MRRPB5
September 2023
Price: USD 2,900.00
The global Dual Ball and Wedge Wire Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the...
Catalog:
GIR
September 2023
Price: USD 4,480.00
The global Double Head Die Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period...
Catalog:
GIR
September 2023
Price: USD 4,480.00
Microelectronic solder wire is composed of tin alloy and additives. The alloy components are divided into tin-lead and lead-free additives, which are...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
Double-head die bonder is a kind of equipment used to fix and package electronic components. It is commonly used in the semiconductor industry,...
Catalog:
MRRPB5
September 2023
Price: USD 2,900.00
