0 items USD 0.00Search
Your search for "Die Cutting Machine" gave back 9792 results.
The global SiC Schottky Diodes Bare Dies market size is expected to reach $ 45 million by 2029, rising at a market growth of 15.7% CAGR during the...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global SiC MOSFET Bare Die market is projected to reach US$ 42 million in 2029, increasing from US$ 13 million in 2022, with the CAGR of 14.6%...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
Bare die is used in a broad array of industries, and markets, including aerospace, military, avionics, automotive and other high-end industries...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
The global Bare Die Shipping, Handling, Processing and Storage market is projected to reach US$ 1503.6 million in 2029, increasing from US$ 1000...
Catalog:
MRRPB5
September 2023
Price: USD 2,900.00
The global Thermal Conductivity Sintering Die Attach Adhesive market size is expected to reach $ 232.5 million by 2029, rising at a market growth of...
Catalog:
GIR
July 2023
Price: USD 4,480.00
The global SiC Schottky Diodes (Bare Die) market size is expected to reach $ 22 million by 2029, rising at a market growth of 12.2% CAGR during the...
Catalog:
GIR
June 2023
Price: USD 4,480.00
Die Attach Adhesives for LED are the perfect solution for mounting temperature-sensitive chips on smart cards, as their curing temperatures lie...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
The global Silver Sintering Die Attach Paste market size is expected to reach $ 242.3 million by 2029, rising at a market growth of 4.8% CAGR during...
Catalog:
GIR
July 2023
Price: USD 4,480.00
The global SiC Schottky Diodes Bare Dies market size is projected to grow from US$ 15 million in 2022 to US$ 46 million in 2029; it is expected to...
Catalog:
LPI
June 2023
Price: USD 3,660.00
The global GaN HEMT Die market size is projected to grow from US$ 23 million in 2022 to US$ 57 million in 2029; it is expected to grow at a CAGR of...
Catalog:
LPI
July 2023
Price: USD 3,660.00
The global GaN Bare-die market size is projected to grow from US$ 23 million in 2022 to US$ 57 million in 2029; it is expected to grow at a CAGR of...
Catalog:
LPI
July 2023
Price: USD 3,660.00
Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global Die Flip Chip Bonder market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR)...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
