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Your search for "Die Cutting Machine" gave back 9829 results.
The global Pressure-less Sintering Die Attach Adhesives market size is expected to reach $ million by 2029, rising at a market growth of % CAGR...
Catalog:
GIR
July 2023
Price: USD 4,480.00
Pressure-less sintering is a conventional sintering method, which refers to a method of sintering by heating the product under normal pressure. This...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global VCSEL Bare Die market size was valued at USD 139.9 million in 2022 and is forecast to a readjusted size of USD 189.9 million by 2029 with...
Catalog:
GIR
July 2023
Price: USD 3,480.00
The global GaN HEMT Die market size was valued at USD 24 million in 2022 and is forecast to a readjusted size of USD 56 million by 2029 with a CAGR...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global GaN Bare-die market size was valued at USD 24 million in 2022 and is forecast to a readjusted size of USD 56 million by 2029 with a CAGR...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global SiC MOSFET Bare Die market size is projected to grow from US$ 13 million in 2022 to US$ 35 million in 2029; it is expected to grow at a...
Catalog:
LPI
June 2023
Price: USD 3,660.00
The global Diode Bare Dies market size was valued at USD 87 million in 2022 and is forecast to a readjusted size of USD 115.4 million by 2029 with a...
Catalog:
GIR
June 2023
Price: USD 3,480.00
The global Die Encapsulant market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during...
Catalog:
MRRPB5
April 2023
Price: USD 2,900.00
The global High Thermal Conductivity Sintering Die Attach Adhesives market size is expected to reach $ 232.5 million by 2029, rising at a market...
Catalog:
GIR
July 2023
Price: USD 4,480.00
The global Fast Recovery Diode (FRD) Bare Die market size is expected to reach $ 20 million by 2029, rising at a market growth of 5.4% CAGR during...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global FRD Bare Die for IGBT Module market size is expected to reach $ 27 million by 2029, rising at a market growth of 7.2% CAGR during the...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global Eutectic Die Bonding System market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with...
Catalog:
GIR
July 2023
Price: USD 3,480.00
The global MOSFET Bare Dies market size was valued at USD 1920 million in 2022 and is forecast to a readjusted size of USD 2513.7 million by 2029...
Catalog:
GIR
June 2023
Price: USD 3,480.00
The global Wire Drawing Dies market size was valued at US$ 670.1 million in 2022. With growing demand in downstream market and recovery from...
Catalog:
LPI
August 2023
Price: USD 3,660.00
The global Eutectic Die Bonding System market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a...
Catalog:
LPI
May 2023
Price: USD 3,660.00
