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Your search for "Die Cutting Machine" gave back 9792 results.
The global Eutectic Die Bonding System market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast...
Catalog:
GIR
July 2023
Price: USD 4,480.00
The global MOSFET Bare Dies market is projected to reach US$ 25170 million in 2029, increasing from US$ 1866 million in 2022, with the CAGR of 4.1%...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global Diode Bare Dies market size is expected to reach $ 115.4 million by 2029, rising at a market growth of 4.1% CAGR during the forecast...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global MOSFET Bare Dies market size is expected to reach $ 2513.7 million by 2029, rising at a market growth of 3.9% CAGR during the forecast...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global Diode Bare Dies market size is projected to grow from US$ 83 million in 2022 to US$ 112.3 million in 2029; it is expected to grow at a...
Catalog:
LPI
June 2023
Price: USD 3,660.00
The bare die IGBTs are available in different trade-offs, with a maximum voltage of 1700V and a collector current up to 200A, for a wide range of...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
This report studies the SiC Schottky Barrier Diodes Bare Dies (SiC SBD bare dies). The global SiC Schottky Diodes Bare Dies market is projected to...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global Bare Die Shipping, Handling, Processing and Storage market size is expected to reach $ 1521 million by 2029, rising at a market growth of...
Catalog:
GIR
September 2023
Price: USD 4,480.00
The global SiC MOSFET Bare Die market size is expected to reach $ 35 million by 2029, rising at a market growth of 14.0% CAGR during the forecast...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global Bare Die Shipping, Handling, Processing and Storage market size was valued at US$ 978.3 million in 2022. With growing demand in downstream...
Catalog:
LPI
August 2023
Price: USD 3,660.00
The global Pressure Sensor Dies market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR)...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
The global MOSFET Bare Dies market size is projected to grow from US$ 1825.4 million in 2022 to US$ 2443.4 million in 2029; it is expected to grow at...
Catalog:
LPI
June 2023
Price: USD 3,660.00
Eutectic Die Bonding System refers to a die bonding technique used for devices that require enhanced heat dissipation, such as high-power amplifiers...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global VCSEL Bare Die market size is projected to grow from US$ 133 million in 2022 to US$ 185.1 million in 2029; it is expected to grow at a...
Catalog:
LPI
June 2023
Price: USD 3,660.00
