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Your search for "Epoxy Resins" gave back 514 results.
Summary Wind Turbine Blade Epoxy Resin market research report provides the newest industry data and industry future trends, allowing you to identify...
ICRW
January 2024
Price: USD 2,960.00
Rigid copper clad laminate is a plate-like material formed by impregnating the reinforcing material with resin and hot pressing copper clad foils on...
Catalog: 
MRRPB5
May 2023
Price: USD 2,900.00
Rigid copper clad laminate is a plate-like material formed by impregnating the reinforcing material with resin and hot pressing copper clad foils on...
Catalog: 
MRRPB5
September 2023
Price: USD 4,900.00
The global Die Encapsulant market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during...
Catalog: 
MRRPB5
April 2023
Price: USD 2,900.00
The global Die Encapsulant market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of %...
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MRRPB5
August 2023
Price: USD 4,900.00
The global Electronic Potting and Encapsulating market size was valued at US$ 1764.4 million in 2023. With growing demand in downstream market, the...
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LPI
February 2024
Price: USD 3,660.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
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MRRPB5
October 2023
Price: USD 2,900.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog: 
MRRPB5
January 2024
Price: USD 2,900.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
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MRRPB5
March 2024
Price: USD 2,900.00
A glass epoxy substrate is a specific type of printed circuit board (PCB) material. PCBs serve as the foundation for mounting electronic components,...
Catalog: 
GIR
April 2024
Price: USD 3,480.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog: 
MRRPB5
August 2023
Price: USD 4,900.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog: 
MRRPB5
July 2023
Price: USD 4,900.00
ACF is the initialism for “Anisotropic Conductive Film” or “Anisotropic Conductive Adhesive Film.” It is made of resins, such as thermoset epoxy...
Catalog: 
MRRPB5
October 2023
Price: USD 2,900.00
The global Thermoset Resin Anisotropic Conductive Film (ACF) market size was valued at US$ 450.2 million in 2022. With growing demand in downstream...
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LPI
October 2023
Price: USD 3,660.00
Composite transducers are made by cutting standard piezoelectric materials into grids. The space in the dicing element is filled with epoxy resin,...
Catalog: 
MRRPB5
April 2023
Price: USD 2,900.00

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