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Your search for "Epoxy Resins" gave back 888 results.
Summary The Electronic Potting and Encapsulating market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025, and with a CAGR of...
Catalog:
HYR
February 2021
Price: USD 2,000.00
The global Electronic Potting and Encapsulating market size was valued at US$ 1764.4 million in 2023. With growing demand in downstream market, the...
Catalog:
LPI
February 2024
Price: USD 3,660.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog:
LPI
January 2023
Price: USD 3,660.00
As the global economy recovers in 2021 and the supply of the industrial chain improves, the Embedded Capacitors market will undergo major changes...
Catalog:
Arsta
February 2022
Price: USD 3,690.00
Printed Circuit Board an important electronic component, is the electronic component support body, is the electronic component electrical connection...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog:
GIR
February 2023
Price: USD 3,480.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
A glass epoxy substrate is a specific type of printed circuit board (PCB) material. PCBs serve as the foundation for mounting electronic components,...
Catalog:
GIR
April 2024
Price: USD 3,480.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog:
GIR
January 2023
Price: USD 3,480.00
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
Embedded Capacitance Materials Consist of a Very Thin Dielectric Material Sandwiched Between Two Layers of Copper. During the Manufacturing Process,...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
