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Your search for "LED Driver Module" gave back 1100 results.
The global Plate and Frame Membrane Module market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the...
GIR
April 2024
Price: USD 4,480.00
The global Plate and Frame Membrane Module market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
GIR
April 2024
Price: USD 3,480.00
The global High Tg Epoxy Moulding Compound market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
MRRPB5
April 2024
Price: USD 2,900.00
Resins used to impregnate materials under vacuum pressure, often employed in applications such as composite manufacturing or insulation. The global...
MRRPB5
April 2024
Price: USD 2,900.00
Thermally conductive graphite sheet is a brand-new thermal and heat-dissipating material that conducts heat evenly in two directions, shielding heat...
MRRPB5
April 2024
Price: USD 2,900.00
The global Tubular Membrane Components market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast...
GIR
April 2024
Price: USD 4,480.00
Pressured silver sintering paste is a conductive paste used for electronic device packaging and is usually used for the connection and packaging of...
GIR
April 2024
Price: USD 3,480.00
Magnesium Bisglycinate is a mineral essential for the various enzymatic reactions that occur in our body. It is required for the formation of protein...
GIR
April 2024
Price: USD 3,480.00
Indium recycling refers to the process of extracting and reusing indium metal from various wastes, by-products and scrap materials containing indium...
GIR
April 2024
Price: USD 3,480.00
The global Tubular Membrane Components market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with...
GIR
April 2024
Price: USD 3,480.00
Gallium nitride substrate materials play a key role in the preparation process of gallium nitride semiconductor devices, and common ones include...
MRRPB5
April 2024
Price: USD 2,900.00
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. The global Flip Chip Underfills...
MRRPB5
April 2024
Price: USD 2,900.00
The global Semiconductor Wet Etchants market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
MRRPB5
April 2024
Price: USD 2,900.00
A photo mask, also known as a photomask or reticle, is a high-precision mask used in photolithography processes to define patterns on substrates,...
MRRPB5
April 2024
Price: USD 2,900.00
Magnetic material, the magnetic material that says normally is to point to strong magnetic material, it is ancient and the functional material with...
MRRPB5
April 2024
Price: USD 3,950.00

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