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Your search for "OSAT" gave back 308 results.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
Die bonders are specialized semi- or fully-automatic high-precision machine tools used in semiconductor device fabrications. They fix the...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
GIR
January 2023
Price: USD 3,480.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
Advanced packaging inspection and metrology equipment play a crucial role in the semiconductor industry, where they are used for quality control,...
Catalog:
MRRPB5
April 2024
Price: USD 2,900.00
The global Die Attach Systems market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
Catalog:
GIR
April 2023
Price: USD 3,480.00
Summary Thermo Compression Bonder market research report provides the newest industry data and industry future trends, allowing you to identify the...
Catalog:
ICRW
April 2021
Price: USD 3,000.00
Summary ICRWorld’s Thermo Compression Bonder market research report provides the newest industry data and industry future trends, allowing you to...
Catalog:
ICRW
April 2020
Price: USD 2,960.00
Summary Thermo Compression Bonder market research report provides the newest industry data and industry future trends, allowing you to identify the...
Catalog:
ICRW
June 2019
Price: USD 2,960.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
September 2023
Price: USD 4,900.00
Test Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE →...
Catalog:
MRRPB5
September 2023
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
LPI
February 2023
Price: USD 3,660.00
