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Your search for "OSAT" gave back 29 results.
The global market for Ultra Pure Water (UPW) for Semiconductor Manufacturing estimated was at US$ 1,691.91 million in the year 2023, is projected to...
MRRPB5
April 2024
Price: USD 3,350.00
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive...
MRRPB5
October 2023
Price: USD 2,900.00
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of...
MRRPB5
October 2023
Price: USD 2,900.00
High purity bisphenol F epoxy resin is a specialized epoxy resin with extremely low impurities and high chemical purity. It is used in applications...
MRRPB5
October 2023
Price: USD 2,900.00
High purity bisphenol A epoxy resin is a specialized epoxy resin with extremely low impurities and high chemical purity. It is used in applications...
MRRPB5
October 2023
Price: USD 2,900.00
Electronic grade bisphenol A epoxy resin is a specialized epoxy resin designed for use in electronic applications, such as encapsulation, potting,...
MRRPB5
October 2023
Price: USD 2,900.00
Electronic grade special epoxy resin refers to epoxy resins formulated specifically for use in high-precision and high-reliability electronic...
MRRPB5
October 2023
Price: USD 2,900.00
Electronic grade bisphenol F epoxy resin is a specialized epoxy resin designed for use in electronic applications, such as encapsulation, potting,...
MRRPB5
October 2023
Price: USD 2,900.00
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of...
MRRPB5
January 2024
Price: USD 2,900.00
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive...
MRRPB5
January 2024
Price: USD 2,900.00
Silica and alumina spherical filler refers to composite particles containing silica and alumina used as fillers in various industrial applications,...
MRRPB5
October 2023
Price: USD 2,900.00
Semiconductor wafer packaging refers to the process of processing wafers to obtain independent chips according to product model and functional...
MRRPB5
July 2023
Price: USD 4,900.00
The global Ultra High Purity Aluminum Sputtering Targets for IC Assembly and Testing market size is projected to grow from US$ 75 million in 2022 to...
LPI
June 2023
Price: USD 3,660.00
Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip...
MRRPB5
November 2023
Price: USD 2,900.00
According to our (Global Info Research) latest study, the global Ultra High Purity Aluminum Sputtering Targets for IC Assembly and Testing market...
GIR
June 2023
Price: USD 3,480.00

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