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Your search for "OSAT" gave back 312 results.
The global Flip Chip Bonder market size was valued at US$ 283.7 million in 2023. With growing demand in downstream market, the Flip Chip Bonder is...
Catalog:
LPI
January 2024
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
January 2023
Price: USD 4,000.00
The global Test Handler market size was valued at USD 1836.4 million in 2023 and is forecast to a readjusted size of USD 3818.7 million by 2030 with...
Catalog:
GIR
January 2024
Price: USD 3,480.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
The global Spherical Lead Bonding Machine market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
Catalog:
GIR
November 2023
Price: USD 3,480.00
The global Ball Wire Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of...
Catalog:
GIR
August 2023
Price: USD 3,480.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
Catalog:
LPI
January 2023
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
January 2023
Price: USD 4,000.00
The global Wedge Weld Lead Bonding Machine market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
Catalog:
GIR
February 2024
Price: USD 3,480.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
Catalog:
MRRPB5
March 2024
Price: USD 3,950.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Wire Wedge Bonder Equipment market size was valued at US$ 75 million in 2023. With growing demand in downstream market, the Wire Wedge...
Catalog:
LPI
January 2024
Price: USD 3,660.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
