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Your search for "Semiconductor Packaging" gave back 105479 results.
The global Semiconductor Packaging and Testing Equipment market was valued at US$ 11590 million in 2023 and is anticipated to reach US$ 17510 million...
Catalog: 
MRRPB5
March 2024
Price: USD 2,900.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global Semiconductor Packaging Bonding Wire market size is expected to reach $ 957.9 million by 2030, rising at a market growth of 4.1% CAGR...
Catalog: 
GIR
March 2024
Price: USD 4,480.00
The global Semiconductor Packaging Materials market was valued at US$ 26860 million in 2023 and is anticipated to reach US$ 63810 million by 2030,...
Catalog: 
MRRPB5
March 2024
Price: USD 2,900.00
The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
Heat spreaders for semiconductor devices play a crucial role in managing and dissipating heat generated by the electronic components. They help to...
Catalog: 
LPI
February 2024
Price: USD 3,660.00
Metal bonding wire and ribbon are materials commonly used in the electronics industry for connecting various components in electronic devices, such...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global Semiconductor Packaging Bonding Wire market size was valued at USD 722.3 million in 2023 and is forecast to a readjusted size of USD 957.9...
Catalog: 
GIR
March 2024
Price: USD 3,480.00
The global Semiconductor Ceramic Packaging Materials market size was valued at USD 6322.9 million in 2023 and is forecast to a readjusted size of USD...
Catalog: 
GIR
February 2024
Price: USD 3,480.00
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The semiconductor packaging wedge is a welding needle of Bonding Machine. It is used for the bonding and welding of gold wire, silver wire, copper...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global Gold Electroplating Solution for Semiconductor Packaging market was valued at US$ 461.3 million in 2023 and is anticipated to reach US$...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00
The global Semiconductor Ceramic Packaging Materials market size was valued at US$ 6011.4 million in 2023. With growing demand in downstream market,...
Catalog: 
LPI
February 2024
Price: USD 3,660.00
The global Heat Spreaders for Semiconductor Packaging market size is expected to reach $ 234.7 million by 2030, rising at a market growth of 10.1%...
Catalog: 
GIR
February 2024
Price: USD 4,480.00
For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing,...
Catalog: 
MRRPB5
February 2024
Price: USD 2,900.00

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