0 items USD 0.00Search
Your search for "chip design" gave back 50786 results.
An alternative to white oak. The global White Oak Substitute market is projected to reach US$ million in 2029, increasing from US$ million in 2022,...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Conductive die attach films (CDAF) allow lead frame package manufacturers the same process advantages offered by non-conductive die attach film...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Semiconductor Die Attach Adhesives market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by...
Catalog:
GIR
February 2024
Price: USD 3,480.00
Anisotropic conductive film (ACF) is a lead-free and environmentally friendly adhesive interconnect system that is commonly used in liquid crystal...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Silicon nitride support membranes are thin, flat structures made from silicon nitride (Si3N4) material that are used in various scientific and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Underfill is one of the Flip-Chip processes for...
Catalog:
MRRPB5
August 2023
Price: USD 2,900.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Silicon Nitride (SiNx) Film refers to silicon nitride compound thin film, mainly used as electrical insulation layer of microelectronic technology...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Polyethylene terephthalate (PET), commonly known as polyester resin, is a condensation polymer of terephthalic acid and ethylene glycol, and together...
Catalog:
MRRPB5
June 2023
Price: USD 2,900.00
The global Tin-absorbing Heaters market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
November 2023
Price: USD 3,480.00
Silicon Nitride Support Films are suitable where carbon or plastic films are not appropriate. These silicon nitride membranes are extremely flat and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
