0 items USD 0.00Search
Your search for "chip design" gave back 50013 results.
The global Recycled PET Chips market size was valued at USD 11020 million in 2023 and is forecast to a readjusted size of USD 16190 million by 2030...
Catalog:
GIR
January 2024
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Film Grade Masterbatch PET Chips market size was valued at USD 1797.1 million in 2023 and is forecast to a readjusted size of USD 2352.7...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Chip Encapsulation Material market size was valued at USD 24470 million in 2023 and is forecast to a readjusted size of USD 33810 million...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Modified Polyester Chips market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast...
Catalog:
GIR
December 2023
Price: USD 4,480.00
Recycling is the collection of used materials that would otherwise be waste to be broken down and remade into new products. Motivations for recycling...
Catalog:
MRRPB5
November 2023
Price: USD 4,350.00
Recycling is the collection of used materials that would otherwise be waste to be broken down and remade into new products. Motivations for recycling...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
ACF is a transparent polymer connecting material with three characteristics of adhesion, conductivity and insulation at the same time. Its remarkable...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Virgin Polyester Chips market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
December 2023
Price: USD 3,480.00
The global Dull Polyester Chips market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR...
Catalog:
GIR
December 2023
Price: USD 3,480.00
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. The global Flip Chip Underfills...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
The global Chip Encapsulation Material market was valued at US$ 23780 million in 2023 and is anticipated to reach US$ 34470 million by 2030,...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Nylon 66 Chips market size was valued at USD 7152.2 million in 2023 and is forecast to a readjusted size of USD 7955 million by 2030 with...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Super Bright Polyester Chips market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
Catalog:
GIR
December 2023
Price: USD 3,480.00
The global Modified Polyester Chips market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
December 2023
Price: USD 3,480.00
