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Your search for "gir global memory computing market 2018 manufacturers countries type application forecast 2023" gave back 207197 results.
Traditional epoxy molding compounds refer to standard epoxy resins used in the encapsulation and protection of electronic components and...
MRRPB5
October 2023
Price: USD 2,900.00
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home...
MRRPB5
January 2023
Price: USD 2,900.00
Flash storage is a data storage technology based on high-speed, electrically programmable memory. The speed of flash storage is how got its name: It...
MRRPB5
January 2024
Price: USD 2,900.00
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of...
MRRPB5
November 2023
Price: USD 2,900.00
Thermal conductive Double-sided tape, also known as thermal conductive adhesive tape, thermal conductive Double-sided tape, and thermal conductive...
MRRPB5
October 2023
Price: USD 2,900.00
Ultra-fine Nitinol wire refers to a specialized type of wire made from Nitinol, a shape memory alloy composed primarily of nickel and titanium...
MRRPB5
August 2023
Price: USD 2,900.00
Sapphire is kind of sapphire materials which is not only with hardest, most durable and scratch-resistant advantages but also offers a broad...
MRRPB5
October 2023
Price: USD 2,900.00
The global Copper Foil for Wireless Charging market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of...
MRRPB5
October 2023
Price: USD 2,900.00
The global Copper Foil for Electromagnetic Shielding market is projected to reach US$ 373.5 million in 2029, increasing from US$ 312.6 million in...
MRRPB5
October 2023
Price: USD 2,900.00
Smart materials are the basis of many applications, including sensors and actuators, or artificial muscles, particularly as electroactive polymers (...
MRRPB5
April 2024
Price: USD 2,900.00
High-performance epoxy molding compounds refer to advanced epoxy resins formulated for demanding electronic applications, such as automotive,...
MRRPB5
October 2023
Price: USD 2,900.00
The global LF RFID Inlays market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven...
MRRPB5
November 2023
Price: USD 3,350.00
The global SMIF Pod Contain market was valued at US$ 703 million in 2023 and is anticipated to reach US$ 1125.2 million by 2030, witnessing a CAGR of...
MRRPB5
March 2024
Price: USD 2,900.00
The global EUV Film market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029)...
GIR
November 2023
Price: USD 4,480.00
Advanced packaging refers to the most advanced packaging forms and technologies at the time. At present, packages with Flip Chip (FC) structure,...
MRRPB5
July 2023
Price: USD 4,900.00

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