0 items USD 0.00Search
Your search for "hjresearch global flip chip substrate industry market research 2017" gave back 320690 results.
Advanced packaging refers to the most advanced packaging forms and technologies at the time. At present, packages with Flip Chip (FC) structure,...
Catalog:
LPI
February 2023
Price: USD 3,660.00
The global Ultra Low Residue (ULR) Semiconductor Fluxes market size was valued at USD 59 million in 2022 and is forecast to a readjusted size of USD...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global Capillary Underfill Material market size was valued at US$ 476.4 million in 2023. With growing demand in downstream market, the Capillary...
Catalog:
LPI
February 2024
Price: USD 3,660.00
The global Chip Adhesives market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of %...
Catalog:
GIR
March 2023
Price: USD 3,480.00
The global Packaging Substrates market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (...
Catalog:
GIR
February 2023
Price: USD 4,480.00
The global Chip Encapsulation Material market size was valued at USD 24470 million in 2023 and is forecast to a readjusted size of USD 33810 million...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Underfill Materials market size was valued at US$ 1145.1 million in 2023. With growing demand in downstream market, the Underfill...
Catalog:
LPI
March 2024
Price: USD 3,660.00
Summary The Dicing Die Bonding Films market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025, and with a CAGR of xx%. The base...
Catalog:
HYR
March 2021
Price: USD 2,000.00
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
Catalog:
MRRPB5
March 2023
Price: USD 2,900.00
Summary The global Noise Suppression Sheet market will reach xxx Million USD in 2021 with CAGR xx% 2021-2026. The objective of report is to define,...
Catalog:
HYR
March 2022
Price: USD 1,800.00
According to our Publisher latest study, the global Ceramic Packaging Substrate Material market size was valued at USD million in 2022 and is...
Catalog:
GIR
February 2023
Price: USD 3,480.00
Summary Publisher estimates that the Dicing Die Bonding Films market size will grow from xxx Million USD in 2020 to xxxx Million USD by 2025, and...
Catalog:
HYR
May 2021
Price: USD 2,000.00
The global Copper Plating Electrolyte and Additives market size was valued at USD 475 million in 2023 and is forecast to a readjusted size of USD 802...
Catalog:
GIR
January 2024
Price: USD 3,480.00
Spherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global Copper Plating Electrolyte and Additives market size was valued at USD 475 million in 2022 and is forecast to a readjusted size of USD 802...
Catalog:
GIR
August 2023
Price: USD 3,480.00
