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Your search for "hjresearch global flip chip substrate industry market research 2017" gave back 320690 results.
Advanced packaging refers to the most advanced packaging forms and technologies at the time. At present, packages with Flip Chip (FC) structure,...
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MRRPB5
July 2023
Price: USD 4,900.00
The global Chip Encapsulation Material market was valued at US$ 23780 million in 2023 and is anticipated to reach US$ 34470 million by 2030,...
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MRRPB5
February 2024
Price: USD 2,900.00
Publisher' newest research report, the “Chip Encapsulation Material Industry Forecast” looks at past sales and reviews total world Chip...
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LPI
January 2023
Price: USD 3,660.00
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC)...
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MRRPB5
August 2023
Price: USD 2,900.00
Publisher' newest research report, the “WLCSP Sorter Industry Forecast” looks at past sales and reviews total world WLCSP Sorter sales in 2022,...
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LPI
January 2023
Price: USD 3,660.00
The global Ultra Low Residue (ULR) Semiconductor Fluxes market size is projected to grow from US$ 56 million in 2022 to US$ 94 million in 2029; it is...
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LPI
July 2023
Price: USD 3,660.00
The “Flux for Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Flux for Semiconductor Packaging sales in 2022,...
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LPI
March 2023
Price: USD 3,660.00
The “Electronic Circuit Board Underfill Material Industry Forecast” looks at past sales and reviews total world Electronic Circuit Board Underfill...
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LPI
March 2023
Price: USD 3,660.00
Highlights The global Chip Encapsulation Material market was valued at US$ 25810 million in 2022 and is anticipated to reach US$ 34470 million by...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Copper Plating Solutions for Semiconductor Manufacturing market size was valued at USD million in 2022 and is forecast to a readjusted...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global Tin Alloy Solder Ball market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
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GIR
August 2023
Price: USD 3,480.00
The global High Temperature Solder Ball market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
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GIR
August 2023
Price: USD 3,480.00
HJ Research delivers in-depth insights on the global GaAs Substrate market in its upcoming report titled, Global GaAs Substrate Market Report 2015-...
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HJResearch
August 2022
Price: USD 3,200.00
The appearance of nickel vanadium sputtering targets is metallic in nature.The films which are obtained by nickel vanadium sputtering targets can be...
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LPI
February 2023
Price: USD 3,660.00
Aluminum nitride substrate refers to a ceramic material with aluminum nitride (AIN) as the main crystalline phase, and then etched with metal...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
