0 items USD 0.00Search
Your search for "hjresearch global tape wafer market professional survey 2019 manufacturers regions countries types" gave back 203967 results.
The global Back Grinding Tapes market size was valued at USD 213.6 million in 2023 and is forecast to a readjusted size of USD 302 million by 2030...
Catalog:
GIR
January 2024
Price: USD 3,480.00
The global Back Grinding Tapes (BGT) market size was valued at USD 193.1 million in 2023 and is forecast to a readjusted size of USD 266.1 million by...
Catalog:
GIR
January 2024
Price: USD 3,480.00
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Tape for wafer processing. The global Tape for Wafer market was valued at US$ 485 million in 2023 and is anticipated to reach US$ 658.9 million by...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global UV Curable Backgrinding Tapes market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029...
Catalog:
GIR
August 2023
Price: USD 3,480.00
The global UV Curable Dicing Tapes market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
August 2023
Price: USD 3,480.00
UV (Ultraviolet) Tapes are tapes that are resistant to ultraviolet radiation. These tapes often have special materials and coatings that allow them...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
The global Dicing Tape market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Non-UV dicing tapes are used for large die sizes in the electronics industry. It is made up of flexible films, which is commonly made up of PVC...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The Dicing Tape is designed for Blade Dicing and Laser Dicing Process. The global Tape for Wafer Dicing market is projected to grow from US$ million...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
UV Tape is adhesive tape for semiconductor process. It is designed for surface protection of semiconductor wafer during backgrinding process.Easily...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
The global Semiconductor Wafer Tape market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
