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Your search for "metal packaging" gave back 10498 results.
Publisher' newest research report, the “Co-fired Ceramic Substrates Industry Forecast” looks at past sales and reviews total world Co-fired...
Catalog:
LPI
January 2023
Price: USD 3,660.00
The global Co-fired Ceramic Substrates market was valued at US$ 4580.5 million in 2023 and is anticipated to reach US$ 6610.4 million by 2030,...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Semiconductor Materials market size was valued at USD 78540 million in 2023 and is forecast to a readjusted size of USD 121270 million by...
Catalog:
GIR
February 2024
Price: USD 3,480.00
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Co-fired Ceramic Substrates market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
Since the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
The global Silicon Photodiodes market size was valued at US$ 304.2 million in 2023. With growing demand in downstream market, the Silicon Photodiodes...
Catalog:
LPI
January 2024
Price: USD 3,660.00
The global Heat Spreaders for Semiconductor Packaging market size is expected to reach $ 234.7 million by 2030, rising at a market growth of 10.1%...
Catalog:
GIR
February 2024
Price: USD 4,480.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
Catalog:
LPI
March 2023
Price: USD 3,660.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Package Lids market was valued at US$ 186 million in 2022 and is anticipated to reach US$ 330.3 million by 2029, witnessing a CAGR of 7.5...
Catalog:
MRRPB5
April 2023
Price: USD 2,900.00
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. The global Integrated Circuit...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Package Lids market size was valued at USD 191.4 million in 2022 and is forecast to a readjusted size of USD 310.9 million by 2029 with a...
Catalog:
GIR
March 2023
Price: USD 3,480.00
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. According to our Publisher latest...
Catalog:
GIR
January 2023
Price: USD 3,480.00
