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Your search for "metal packaging" gave back 10451 results.
The global Metallic Packaged Infrared Detector market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by...
Catalog:
GIR
May 2023
Price: USD 3,480.00
Metal has been used in electronic packaging earlier because of its good mechanical strength, good thermal conductivity, electromagnetic shielding...
Catalog:
MRRPB5
April 2023
Price: USD 2,900.00
HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
The global Metal-Ceramic Package Shell market size was valued at USD 2936.2 million in 2022 and is forecast to a readjusted size of USD 4258.5...
Catalog:
GIR
June 2023
Price: USD 3,480.00
HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic...
Catalog:
LPI
January 2023
Price: USD 3,660.00
Highlights The global Metal Shell Electronic Packaging market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029,...
Catalog:
MRRPB5
March 2023
Price: USD 2,900.00
The global Semiconductor Packaging Bonding Wire market size is expected to reach $ 957.9 million by 2030, rising at a market growth of 4.1% CAGR...
Catalog:
GIR
March 2024
Price: USD 4,480.00
Metal bonding wire and ribbon are materials commonly used in the electronics industry for connecting various components in electronic devices, such...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Semiconductor Packaging Bonding Wire market size was valued at USD 722.3 million in 2023 and is forecast to a readjusted size of USD 957.9...
Catalog:
GIR
March 2024
Price: USD 3,480.00
Copper and Coated Copper Bonding Wires The global Electronic Packaging Copper and Coated Copper Bonding Wires market was valued at US$ 362 million in...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
Due to its excellent comprehensive properties, aluminum-silicon alloy electronic packaging materials have broad application prospects in the field of...
Catalog:
LPI
January 2023
Price: USD 3,660.00
Due to its excellent comprehensive properties, aluminum-silicon alloy electronic packaging materials have broad application prospects in the field of...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
The global Infrared Detector Package Shell market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the...
Catalog:
GIR
July 2023
Price: USD 4,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Reflow Oven for Semiconductor Packaging market size is expected to reach $ 400.6 million by 2029, rising at a market growth of 4.4% CAGR...
Catalog:
GIR
July 2023
Price: USD 4,480.00
