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Your search for "metal packaging" gave back 10447 results.
The “Multilayer Co-fired Substrate Industry Forecast” looks at past sales and reviews total world Multilayer Co-fired Substrate sales in 2022,...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Since the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal...
Catalog:
LPI
March 2023
Price: USD 3,660.00
The global Multilayer Co-fired Substrate market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of %...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global Ferrite Bead Inductors market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of %...
Catalog:
MRRPB5
January 2023
Price: USD 2,900.00
The global Tungsten Copper Heat Sink market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
This report studies the HTCC Alumina Ceramic Substrates and LTCC Alumina Ceramic Substrates The global Alumina Multilayered Ceramic Substrates market...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
The global Electronic Packaging Materials market size was valued at US$ 5365.4 million in 2023. With growing demand in downstream market, the...
Catalog:
LPI
January 2024
Price: USD 3,660.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
This report studies the HTCC and LTCC Ceramic Substrates. The global Multilayered Ceramic Substrates market is projected to grow from US$ 341 million...
Catalog:
MRRPB5
June 2023
Price: USD 4,900.00
A through-hole resistor is a fixed resistor with long, flexible leads that can be snapped into a breadboard or soldered into a printed circuit board...
Catalog:
MRRPB5
May 2023
Price: USD 2,900.00
The global Through-Hole Metal Film Resistors market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by...
Catalog:
GIR
May 2023
Price: USD 3,480.00
The global Multilayer Co-fired Substrate market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
This report studies the Electronic Packaging Materials market. Electronic packaging materials are used to carry electronic components and their...
Catalog:
MRRPB5
November 2023
Price: USD 3,350.00
This report studies the Electronic Packaging Materials market. Electronic packaging materials are used to carry electronic components and their...
Catalog:
MRRPB5
January 2023
Price: USD 4,000.00
The global Metal Lift-Off Systems market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a...
Catalog:
GIR
October 2023
Price: USD 3,480.00
