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mrrpb5 global microbial food packaging addition market research report 2018
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Global Liquid Packaging Material for Semiconductor Market 2024 by Company, Regions, Type and Application, Forecast to 2030

The global Liquid Packaging Material for Semiconductor market size was valued at US$ 1684 million in 2023 and is forecast to a readjusted size of USD...
Catalog: 
Semiconductors
GIR
Global
August 2024
Price: USD 3,480.00

Global Ceramic Packaging Vanadium Oxide Infrared Detectors Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Vanadium oxide (VOx) infrared detectors are devices used for detecting infrared radiation based on the properties of vanadium oxide material. These...
Catalog: 
Semiconductors
GIR
Global
August 2024
Price: USD 3,480.00

Global Semiconductor Packaging (IDM) Market Growth (Status and Outlook) 2024-2030

“Integrated Device Manufacturer (IDM)” refers to corporations that handles all processes in manufacturing semiconductors. This means one corporation...
Catalog: 
Semiconductors
LPI
Global
August 2024
Price: USD 3,660.00

Global Prepress for Packaging Market Growth (Status and Outlook) 2024-2030

The global Prepress for Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Prepress for Packaging...
Catalog: 
IT Services
LPI
Global
August 2024
Price: USD 3,660.00

Global Metal Packaging Vanadium Oxide Infrared Detectors Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Vanadium oxide (VOx) infrared detectors are devices used for detecting infrared radiation based on the properties of vanadium oxide material. These...
Catalog: 
Semiconductors
GIR
Global
August 2024
Price: USD 3,480.00

Global Wafer Level Packaging Vanadium Oxide Infrared Detectors Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Vanadium oxide (VOx) infrared detectors are devices used for detecting infrared radiation based on the properties of vanadium oxide material. These...
Catalog: 
Semiconductors
GIR
Global
August 2024
Price: USD 3,480.00

Global CPGA Packaging Market Growth 2024-2030

A PGA package made using ceramic materials. It has high heat resistance and durability and is suitable for high temperature environments and...
Catalog: 
Semiconductors
LPI
Global
August 2024
Price: USD 3,660.00

Global Electroless Plating Solutions for Package Substrate Market 2024 by Company, Regions, Type and Application, Forecast to 2030

The global Electroless Plating Solutions for Package Substrate market size was valued at US$ 188 million in 2023 and is forecast to a readjusted size...
Catalog: 
Semiconductors
GIR
Global
August 2024
Price: USD 3,480.00

Global Semiconductor Chip Package Test Probe Market Growth 2024-2030

The global Semiconductor Chip Package Test Probe market size was valued at US$ 502.6 million in 2023. With growing demand in downstream market, the...
Catalog: 
Semiconductors
LPI
Global
August 2024
Price: USD 3,660.00

Global ERP Software for Packaging Industry Market Growth (Status and Outlook) 2024-2030

Packaging industry ERP software refers to specialized enterprise resource planning solutions designed to meet the unique needs and challenges faced...
Catalog: 
IT Services
LPI
Global
August 2024
Price: USD 3,660.00

Global High Frequency Piezoelectric Ceramic Resonators Market Research Report 2024

The global High Frequency Piezoelectric Ceramic Resonators market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
Catalog: 
Semiconductors
MRRPB5
Global
August 2024
Price: USD 2,900.00

Global Organic Soft Drinks Market 2024 by Company, Regions, Type and Application, Forecast to 2030

The global Organic Soft Drinks market size was valued at USD 5752.9 million in 2023 and is forecast to a readjusted size of USD 8082.1 million by...
Catalog: 
Software
GIR
Global
August 2024
Price: USD 3,480.00

Global Semiconductor Chiller Refurbishment Market Research Report 2024

Semiconductor chiller refurbishment refers to the process of upgrading technology, replacing components, and optimizing performance of old chiller...
Catalog: 
Semiconductors
MRRPB5
Global
August 2024
Price: USD 2,900.00

Global ABF Substrate (FC-BGA) Market Research Report 2024

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
Catalog: 
Semiconductors
MRRPB5
Global
August 2024
Price: USD 2,900.00

Global Semiconductor Wafer Tape Market Insights, Forecast to 2030

Semiconductor wafer adhesive tape, also known as wafer scribing adhesive tape or simply referred to as wafer scribing adhesive tape, is a special...
Catalog: 
Semiconductors
MRRPB5
Global
August 2024
Price: USD 4,900.00

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