0 items USD 0.00Search
Your search for "power electronics" gave back 95436 results.
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
Packaging materials mainly include packaging substrates, lead frames, bonding wires, molding compounds, bonding materials, underfill materials,...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
Ceramic packaging material is a commonly used electronic packaging material. Ceramic packaging belongs to airtight packaging. Its advantages are good...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
Thermal paste, also known as thermal paste, is a paste-like substance with good thermal conductivity (but mostly non-conductive) that is generally...
Catalog:
MRRPB5
May 2023
Price: USD 2,900.00
The global Power Cooling Paste For Electronic Products market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during...
Catalog:
GIR
June 2023
Price: USD 4,480.00
The global Power Cooling Paste For Electronic Products market size was valued at USD million in 2022 and is forecast to a readjusted size of USD...
Catalog:
GIR
June 2023
Price: USD 3,480.00
Packaging materials mainly include packaging substrates, lead frames, bonding wires, molding compounds, bonding materials, underfill materials,...
Catalog:
MRRPB5
April 2023
Price: USD 2,900.00
Ceramic packaging material is a commonly used electronic packaging material. Ceramic packaging belongs to airtight packaging. Its advantages are good...
Catalog:
MRRPB5
April 2023
Price: USD 2,900.00
The global Power Mn-Zn Ferrite Cores market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast...
Catalog:
GIR
July 2023
Price: USD 4,480.00
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat...
Catalog:
LPI
February 2023
Price: USD 3,660.00
Packaging materials mainly include packaging substrates, lead frames, bonding wires, molding compounds, bonding materials, underfill materials,...
Catalog:
LPI
March 2023
Price: USD 3,660.00
In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Ceramic packaging material is a commonly used electronic packaging material. Ceramic packaging belongs to airtight packaging. Its advantages are good...
Catalog:
LPI
March 2023
Price: USD 3,660.00
Thermal paste, also known as thermal paste, is a paste-like substance with good thermal conductivity (but mostly non-conductive) that is generally...
Catalog:
LPI
February 2023
Price: USD 3,660.00
MnZn ferrites are a class of soft magnetic materials that have very good electrical, magnetic and optical properties. The global Power Mn-Zn Ferrite...
Catalog:
MRRPB5
July 2023
Price: USD 2,900.00
