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Your search for "qyresearch global ic substrate industry report 2015" gave back 1099 results.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate...
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GIR
September 2024
Price: USD 3,480.00
PICs (power integrated circuits) are defined as ICs combining high-voltage and/or high-current components monolithically with low-voltage/low-current...
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GIR
September 2024
Price: USD 3,480.00
Wireless charging is the transmission of energy from a power source to a device without wires or cables. A wireless charging technology is comprised...
Catalog: 
GIR
September 2024
Price: USD 3,480.00
Bluetooth Low Energy (Bluetooth LE, colloquially BLE, formerly marketed as Bluetooth Smart) is a wireless personal area network technology designed...
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GIR
September 2024
Price: USD 3,480.00
The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral...
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GIR
September 2024
Price: USD 3,480.00
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high...
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GIR
September 2024
Price: USD 3,480.00
Electrosurgical smoke evacuation systems are designed to remove the hazards of electrosurgical smoke plumes from the operating room. The global Smoke...
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GIR
September 2024
Price: USD 3,480.00
Flexographic printing plate is flexible Digital Flexographic Plates, used in flexo printing to transfer ink & images to a flexible substrate,...
GIR
September 2024
Price: USD 3,480.00
Laser Mask Writer is used for photomask manufacturing, it is a maskless lithography systems useing laser source. Compared with Mask writers based on...
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GIR
September 2024
Price: USD 3,480.00
Materials generally used for manufacturing 5G antennas are advanced ceramic materials, starting with raw materials such as barium carbonate, silicon...
GIR
September 2024
Price: USD 3,480.00
OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (...
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GIR
September 2024
Price: USD 3,480.00
The TFL is a melamine-saturated décor paper that is thermally fused directly to the substrate such as MDF or particle board. Particleboard and MDF...
GIR
September 2024
Price: USD 3,480.00
The global High Pressure Processing market size was valued at US$ million in 2023. With growing demand in downstream market, the High Pressure...
Catalog: 
LPI
September 2024
Price: USD 3,660.00
Automotive catalysts typically consist of a coating of PGMs on a substrate. The earlier oxidation catalysts used only platinum and palladium, but the...
GIR
September 2024
Price: USD 3,480.00
Anisotropic conductive film (ACF) is a lead-free and environmentally friendly adhesive interconnect system that is commonly used in liquid crystal...
Catalog: 
GIR
September 2024
Price: USD 3,480.00

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