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Your search for "qyresearch global metal packaging industry 2015 market research report" gave back 35245 results.
The global Precision Cutting Blades for Encapsulation market size was valued at USD 316.9 million in 2022 and is forecast to a readjusted size of USD...
Catalog:
GIR
November 2023
Price: USD 3,480.00
Heat spreaders for semiconductor devices play a crucial role in managing and dissipating heat generated by the electronic components. They help to...
Catalog:
LPI
February 2024
Price: USD 3,660.00
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Co-fired Ceramic Substrates market was valued at US$ 4580.5 million in 2023 and is anticipated to reach US$ 6610.4 million by 2030,...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
The global Semiconductor Materials market size was valued at USD 78540 million in 2023 and is forecast to a readjusted size of USD 121270 million by...
Catalog:
GIR
February 2024
Price: USD 3,480.00
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete...
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MRRPB5
February 2024
Price: USD 2,900.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits. The global Integrated Circuit...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Heat Spreaders for Semiconductor Packaging market size is expected to reach $ 234.7 million by 2030, rising at a market growth of 10.1%...
Catalog:
GIR
February 2024
Price: USD 4,480.00
The global Silicon Photodiodes market size was valued at US$ 304.2 million in 2023. With growing demand in downstream market, the Silicon Photodiodes...
Catalog:
LPI
January 2024
Price: USD 3,660.00
The global Electronics Interconnect Solder Materials market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
Catalog:
GIR
June 2024
Price: USD 3,480.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Heat spreaders for semiconductor devices play a crucial role in managing and dissipating heat generated by the electronic components. They help to...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Optical communication packages, also known as fiber optic packages or optical transceiver packages, are specialized enclosures used to house and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
