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The photoelectric sensor housing is an external enclosure used to protect and house photoelectric sensors. Photoelectric sensors are devices that...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global Laser Housing market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of %...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
TO Headers & Caps refer to the combination of a TO header and a TO cap used in electronic packaging. "TO" stands for "Transistor...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Optical Communication Ceramic Packages market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the...
Catalog:
GIR
March 2024
Price: USD 4,480.00
The global Laser Pump Source Housing market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
The global Photoelectric Sensor Housing market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
The global TO Headers & Caps market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
Microelectronics package housing refers to the external enclosure or casing used to protect and house microelectronic devices. Microelectronics...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
Optical communication packages, also known as fiber optic packages or optical transceiver packages, are specialized enclosures used to house and...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global Optical Communication Module Tube Shell market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the...
Catalog:
GIR
November 2023
Price: USD 4,480.00
The global Metal Ceramic Electrical Equipment Shell market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during...
Catalog:
GIR
August 2023
Price: USD 4,480.00
The global Metal-Ceramic Package Shell market size is expected to reach $ 4258.5 million by 2029, rising at a market growth of 5.5% CAGR during the...
Catalog:
GIR
June 2023
Price: USD 4,480.00
Hybrid integrated circuit (HIC) packages are specialized enclosures used to house and protect hybrid integrated circuits. HICs are a type of...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The global Remote Signaling Lightning Arrester market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to...
Catalog:
LPI
March 2023
Price: USD 3,660.00
The global HTCC Ceramic Substrates market size is expected to reach $ 1254.4 million by 2029, rising at a market growth of 7.5% CAGR during the...
Catalog:
GIR
July 2023
Price: USD 4,480.00
