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DIP sockets or dual inline package sockets feature two parallel rows of connection pins that connect to a motherboard or a printed circuit board. The...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
A system in package (SiP) is a number of integrated circuits enclosed in a single module (package). The global System in Package market was valued at...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
This report studies semiconductor ceramic packaging materials, covering HTCC LTCC, DBC Ceramic Substrate, AMB, DPC, and DBA Ceramic Substrates, etc...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
The global Optical Communication Ceramic Packages market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
Copper and Coated Copper Bonding Wires The global Electronic Packaging Copper and Coated Copper Bonding Wires market was valued at US$ 362 million in...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
A packaged GaN LED comprises an encapsulation made of bonding wires, an optical lens, electrodes, and resist. The global Packaged Gan Led market was...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
Ceramic Electronic Packaging Materials are used to carry electronic components and their interconnection, Function as mechanical support, seal...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Plastic Electronic Packaging Materials are used to carry electronic components and their interconnection, Function as mechanical support, seal...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Metal Electronic Packaging Materials are used to carry electronic components and their interconnection, Function as mechanical support, seal...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size,...
Catalog:
MRRPB5
January 2024
Price: USD 2,900.00
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global A Single in-Line Package (SIP) Socket market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing...
Catalog:
MRRPB5
March 2024
Price: USD 2,900.00
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
The global Metal-Ceramic Package Shell market was valued at US$ 2853.6 million in 2023 and is anticipated to reach US$ 4208.3 million by 2030,...
Catalog:
MRRPB5
February 2024
Price: USD 2,900.00
