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Your search for "" gave back 1533066 results.
UV Tape is adhesive tape for semiconductor process. It is designed for surface protection of semiconductor wafer during backgrinding process.Easily...
LPI
February 2023
Price: USD 3,660.00
UV Tape is adhesive tape for semiconductor process. It is designed for surface protection of semiconductor wafer during backgrinding process.Easily...
MRRPB5
March 2023
Price: USD 2,900.00
The global Wafer Back Grinding Tapes market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a...
Catalog: 
LPI
March 2023
Price: USD 3,660.00
Tape frames hold the wafer or other workpiece during dicing. The “Wafer Tape Frames Industry Forecast” looks at past sales and reviews total world...
Catalog: 
LPI
February 2023
Price: USD 3,660.00
Tape frames hold the wafer or other workpiece during dicing. The global Wafer Tape Frames market was valued at US$ million in 2022 and is anticipated...
Catalog: 
MRRPB5
January 2023
Price: USD 2,900.00
Publisher' newest research report, the “Wafer UV Tape Industry Forecast” looks at past sales and reviews total world Wafer UV Tape sales in 2022...
Catalog: 
LPI
January 2023
Price: USD 3,660.00
Semiconductor Wafer Process Tape, also known as dicing tape or adhesive tape, is a type of tape used in the semiconductor manufacturing process. It...
Catalog: 
MRRPB5
June 2023
Price: USD 2,900.00
UV tapes are a type of pressure-sensitive tapes with high adhesion strength, which reduces drastically on exposure to UV light, thereby allowing...
9Dimen Research
August 2022
Price: USD 3,200.00
UV tapes are a type of pressure-sensitive tapes with high adhesion strength, which reduces drastically on exposure to UV light, thereby allowing...
9Dimen Research
June 2020
Price: USD 2,850.00
The global Automatic Wafer Vacuum Mounter market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of %...
Catalog: 
MRRPB5
November 2023
Price: USD 2,900.00
The global Wafer Thinning and Dicing Film market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast...
GIR
March 2023
Price: USD 4,480.00
Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing...
MRRPB5
November 2023
Price: USD 2,900.00
The global Wafer Thinning and Dicing Film market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at...
LPI
March 2023
Price: USD 3,660.00
According to our publisher latest study, the global Wafer Thinning and Dicing Film market size was valued at USD million in 2022 and is forecast to a...
GIR
March 2023
Price: USD 3,480.00
The global Wafer Vacuum Mounter market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the...
Catalog: 
MRRPB5
November 2023
Price: USD 2,900.00

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