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Your search for "technavio global semiconductor chip packaging market 2017 2021" gave back 131646 results.
Summary Epi/chip. Epitaxy refers to the process of evolving a wafer (sapphire or SiC, for instance) by depositing epitaxial layers on the wafer using...
Catalog:
HYR
May 2022
Price: USD 2,190.00
The global Chip On Board (COB) Packaging Technology market size was valued at US$ million in 2022. With growing demand in downstream market, the Chip...
Catalog:
LPI
December 2023
Price: USD 3,660.00
The global Chip On Board (COB) Packaging Technology market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during...
Catalog:
GIR
November 2023
Price: USD 4,480.00
The global Chip On Board (COB) Packaging Technology market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million...
Catalog:
GIR
November 2023
Price: USD 3,480.00
Summary Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its...
Catalog:
HYR
June 2022
Price: USD 1,800.00
Summary LTCC Ceramic Substrates is a type of multilayer ceramic substrate that made by lower temperature (usually from 850 to 900℃) firing process...
Catalog:
HYR
May 2022
Price: USD 3,100.00
Summary A microfluidic chip is a set of micro-channels etched or molded into a material (glass, silicon or polymer such as PDMS, for...
Catalog:
HYR
June 2022
Price: USD 1,800.00
TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits...
Catalog:
MRRPB5
October 2023
Price: USD 2,900.00
The process of processing the tested wafer to obtain an independent chip, so that the circuit chip is protected from the influence of the surrounding...
Catalog:
LPI
February 2023
Price: USD 3,660.00
The “Software for Chip Design Industry Forecast” looks at past sales and reviews total world Software for Chip Design sales in 2022, providing a...
Catalog:
LPI
March 2023
Price: USD 3,660.00
The global Barcode Label Solution market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR...
Catalog:
LPI
July 2023
Price: USD 3,660.00
The process of processing the tested wafer to obtain an independent chip, so that the circuit chip is protected from the influence of the surrounding...
Catalog:
MRRPB5
July 2023
Price: USD 4,900.00
Market Analysis and Insights: Global Software for Chip Design Market The global Software for Chip Design market is projected to grow from US$ million...
Catalog:
MRRPB5
August 2023
Price: USD 4,900.00
As the global economy recovers in 2021 and the supply of the industrial chain improves, the Flip Chip Service market will undergo major changes...
Catalog:
Arsta
April 2022
Price: USD 3,360.00
A barcode label solution typically refers to a system or software that allows businesses to generate and print barcode labels for their products or...
Catalog:
MRRPB5
July 2023
Price: USD 2,900.00
