Global Dry Etching Equipment Market Strategic Research Report

Scope of the Report

The global Dry Etching Equipment market size is predicted to grow from US$ 13,610 million in 2025 to US$ 20,710 million in 2032; it is expected to grow at a CAGR of 6.2% from 2026 to 2032.

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.

Currently, global production of Dry Etching Equipment is concentrated. The top three manufacturers held 92.16% of the market, in terms of Dry Etching Equipment sales value in 2019. As for the region, APAC is the largest consumption region, holding 76.07% sales revenue market share in 2019, followed by North America, with 13% market share.

With the continuous reduction of integrated circuit process, especially the production of 7nm-28nm advanced process, the demand for dry etching equipment continues to increase. Since DUV lithography machines are limited by the wavelength of light, wafer fabs need to adopt multiple mask processes and use etching processes to achieve smaller sizes. The etching process required for 7nm integrated circuit production is 140 times, which is 2.5 times the 40 times required for 28nm production.

Etching equipment accounts for the highest proportion in the global semiconductor equipment market.

Global competition:

The global etching equipment market presents a highly concentrated competition pattern, with international giants such as Lam Research, Applied Materials, and Tokyo Electron occupying a dominant position. These companies have advanced technology and rich customer resources and have strong competitiveness in the global market.

Chinese competition:

In the Chinese market, local companies such as AMEC and North Huachuang have strong competitiveness in the field of etching machines and have become leading companies in the domestic etching machine industry. These companies continue to increase R&D investment, improve product performance and technical level, and actively seize market share.

Technological progress:

With the continuous advancement of semiconductor technology, the line width of integrated circuits continues to decrease, and the requirements for etching equipment are getting higher and higher.

The development of 3D integrated circuits has promoted the development of etching technology. For example, the competition for the number of stacking layers of 3D NAND has put forward higher requirements for high aspect ratio etching and multi-stack stacking technology.

Market demand:

The rapid development of artificial intelligence, 5G, Internet of Things and other fields has driven the increase in demand for semiconductor chips, which in turn has promoted the growth of the etching equipment market.

Mainland China has become the world's largest semiconductor equipment market for four consecutive years, and the number of new wafer fab projects ranks first in the world, providing a broad development space for the dry etching equipment market.

Policy support:

The Chinese government has continuously issued relevant policies to support the development of the semiconductor industry, including increasing R&D investment and improving the localization rate, which will further promote the growth of the dry etching equipment market.

In summary, the dry etching equipment market has broad development prospects and huge market potential. With technological progress, increased market demand and continuous strengthening of policy support, the dry etching equipment market will continue to grow.

This report presents a comprehensive overview of the global Dry Etching Equipment market, covering market size and forecast, segmentation by product type and application, competitive landscape, leading players and regional and country-level outlook.

Segment by Type

• Inductively Coupled Plasma (ICP)
• Capacitive Coupled Plasma (CCP)
• Reactive Ion Etching (RIE)
• Deep Reactive Ion Etching (DRIE)
• Others

Segment by Application

• Logic and Memory
• MEMS
• Power Device
• Others

Who Can Use This Report?

This report is written for decision-makers who need a clear, data-backed view of the global Dry Etching Equipment market:

• Manufacturers, suppliers and solution providers benchmarking their position and planning product, capacity and go-to-market strategy
• Distributors, channel partners and end users in Logic and Memory, MEMS, Power Device evaluating demand and sourcing options
• Investors, financial analysts and consultants assessing growth opportunities, competitive dynamics and M&A potential
• Government agencies, industry associations and research institutions tracking industry developments and policy impact