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Global CMP Slurry and Pads Market Strategic Research Report

Global CMP Slurry and Pads Market Strategic Research Report
$3,500 USD
Market Research Reports
Strategic Research Report
Global CMP Slurry and Pads Market
$3.36B2025
7%CAGR
2032Forecast
Market Research Reports · Global
Market Research Reports Intelligence Series

By Type: CMP Slurry, CMP Pads

Regional Forecast: Asia Pacific, Latin America, MEA, Europe, North America

Key Players: Entegris (CMC Materials), Resonac, Fujimi Incorporated, Qnity Electronics, Merck KGaA (Versum Materials), Fujifilm, AGC, KC Tech, JSR Corporation, Anjimirco Shanghai, Soulbrain, Saint-Gobain, Ace Nanochem, Dongjin Semichem, Vibrantz (Ferro), WEC Group, SKC (SK Enpulse), Shanghai Xinanna Electronic Technology, Hubei Dinglong, Samsung SDI, Fujibo Group, 3M, FNS TECH, IVT Technologies Co, Ltd., TWI Incorporated, KPX Chemical, Engis Corporation, TOPPAN INFOMEDIA, CHUANYAN, Zhuhai Cornerstone Technologies, Konfoong Materials International, Tianjin Helen, Shenzhen Angshite Technology, Advanced Nano Products Co., Ltd, Zhejiang Bolai Narun Electronic Materials, Dongguan Golden Sun Abrasives, Shinmicro Materials (Jiaxing), Beijing Hangtian Saide

Region: Global
Formats: PDF, Excel, Word & PowerPoint
Base year: 2025 · forecast to 2032
Length: 209 pages
Market size 2025
$3.36B
Billion USD
Forecast CAGR
7%
2025-2032
Forecast 2032
$5.4B
Projected
区域
5
Asia Pacific · Latin America · MEA · Europe · North America

概述

Scope of the Report

The global CMP Slurry and Pads market size is predicted to grow from US$ 3,364 million in 2025 to US$ 5,174 million in 2032; it is expected to grow at a CAGR of 7.0% from 2026 to 2032.

CMP slurries and CMP pads are the core consumable set enabling wafer planarization in IC manufacturing. In CMP, controlled backside pressure brings the wafer front surface into contact with a rotating pad while a chemical-and-abrasive slurry at the interface drives simultaneous chemical reaction and mechanical abrasion to remove overburden and achieve global/local planarity. In practice, these are not “generic” materials: slurry chemistries are engineered by film stack (dielectric/oxide including STI and ILD, tungsten, copper, barrier layers, and emerging metals), while pad platforms are tuned via hardness, pore structure, compressibility, and groove patterns to hit the target removal rate, selectivity, within-wafer non-uniformity, and defectivity for each CMP module. Leading suppliers increasingly position CMP as a system: slurry + pad + post-CMP cleaning chemistries/brushes + filtration/monitoring to reduce particles/residues and stabilize yield.

Upstream inputs cluster into (i) ultra-high-purity abrasives and dispersion systems (e.g., silica families and ceria abrasives for selective oxide/ILD applications), (ii) specialty formulation chemicals (oxidizers, complexing agents, corrosion inhibitors, surfactants, pH control, trace-metal management), and (iii) pad material supply (dominantly microporous polyurethane constructions with engineered grooves). Midstream CMP-consumables manufacturing is governed by customer specification and qualification: product or manufacturing changes can trigger customer re-qualification, adding switching friction and elevating the importance of local field/application support. Competitive structure is concentrated and platform-led. In CMP Slurry, the global key players are Entegris (CMC Materials), Resonac, Fujimi Incorporated, Qnity Electronics, Merck KGaA (Versum Materials), Fujifilm, AGC, KC Tech, JSR Corporation and Anjimirco Shanghai, etc. While in CMP pad, the key players are Qnity Electronics, Fujibo Group, Entegris (CMC Materials), and Hubei Dinglong, etc.

Market dynamics are being shaped by three technical megatrends: (1) more CMP steps and tighter defect budgets in advanced logic and advanced memory; (2) higher selectivity and stop-on-film requirements across oxide/STI, Cu/barrier, W, and emerging materials; and (3) stronger coupling of consumables with post-CMP cleaning/filtration/monitoring to control particles, trace metals, and organic residues. On the supply side, differentiation is shifting from “headline removal rate” toward “wide process window + low defectivity + stable CoO,” supported by integrated consumables portfolios and closer co-optimization with customers’ roadmaps, alongside a visible push toward localized, cost-competitive, and more resilient supply chains. Key demand drivers remain structurally tied to rising interconnect complexity (CMP adoption historically tracked the rapid increase in metal layers and challenging topography) and the unit-driven nature of consumables demand during upcycles—Entegris, for example, has explicitly pointed to CMP consumables as a contributor to growth in its results communications.

This report presents a comprehensive overview of the global CMP Slurry and Pads market, covering market size and forecast, segmentation by product type and application, competitive landscape, leading players and regional and country-level outlook.

Segment by Type

  • CMP Slurry
  • CMP Pads

Segment by Semiconductor Type

  • Silicon Semiconductor
  • SiCk & GaN Semiconductor
  • Others

Segment by Process

  • IC Manufacturing
  • Wafer/Substrate Manufacturing
  • Others

Segment by Wafer Size

  • 300mm Wafer
  • 200mm Wafer
  • Others

Who Can Use This Report?

This report is written for decision-makers who need a clear, data-backed view of the global CMP Slurry and Pads market:

  • Manufacturers, suppliers and solution providers benchmarking their position and planning product, capacity and go-to-market strategy
  • Distributors, channel partners and end users in key end-use industries evaluating demand and sourcing options
  • Investors, financial analysts and consultants assessing growth opportunities, competitive dynamics and M&A potential
  • Government agencies, industry associations and research institutions tracking industry developments and policy impact

Market snapshot

Global CMP Slurry and Pads Market Strategic Research Report snapshot, 2025–2032

Source: Market Research Reports
Market size CAGR 7%
Regional growth momentum
Market share by segment
Key metrics
Base value
$3.36B
2025
Forecast
$5.4B
2032
CAGR
7%
2025–2032
区域
5
global
Key companies
Entegris (CMC Materials)ResonacFujimi IncorporatedQnity ElectronicsMerck KGaA (Versum Materials)FujifilmAGCKC Tech
© MarketResearchReports.comDisclaimer: The actual data may vary in the final report which undergoes verification check post order confirmation.

Segments covered in this report

By Type
CMP SlurryCMP Pads

Table of contents

Click a chapter to expand
01Executive Summary
02Industry Overview & Forecast
  • 2.1.1 Market Definition and Scope
  • 2.1.2 Market Size and Growth Forecast
  • 2.1.3 Volume Analysis
  • 2.1.4 Segment Outlook by Type
  • 2.1.5 Segment Outlook by Application
  • 2.1.6 Regional Outlook
  • 2.1.7 Structural Developments Shaping the Forecast
  • 2.1.8 Forecast Risks and Sensitivities
03Market Segmentation by Type
  • 3.1 Market Segmentation by Type
  • 3.1.1 Market by Type Overview
  • 3.1.2 CMP Slurry
  • 3.1.3 CMP Pads
  • 3.1.4 Volume Analysis
04Market Segmentation by Application
  • 4.1 Market Segmentation by Application
  • 4.1.1 Market by Application Overview
  • 4.1.2 Volume Analysis
05Regional Market Forecast
  • Asia Pacific
  • North America
  • Europe
  • Middle East & Africa
  • Latin America
06Country-Level Market Forecast
  • 6.1 Asia Pacific
  • 6.1.1 China
  • 6.1.2 Japan
  • 6.1.3 Korea
  • 6.1.4 Southeast Asia
  • 6.1.5 India
  • 6.1.6 Australia
  • 6.1.7 Rest of Asia Pacific
  • 6.2 North America
  • 6.2.1 United States
  • 6.2.2 Canada
  • 6.2.3 Mexico
  • 6.2.4 Rest of North America
  • 6.3 Europe
  • 6.3.1 Germany
  • 6.3.2 France
  • 6.3.3 UK
  • 6.3.4 Italy
  • 6.3.5 Russia
  • 6.3.6 Rest of Europe
  • 6.4 Middle East & Africa
  • 6.4.1 Egypt
  • 6.4.2 South Africa
  • 6.4.3 Israel
  • 6.4.4 Turkey
  • 6.4.5 GCC Countries
  • 6.4.6 Rest of Middle East & Africa
  • 6.5 Latin America
  • 6.5.1 Brazil
  • 6.5.2 Rest of Latin America
07Growth Drivers & Inhibitors
  • 7.1 Growth Drivers & Inhibitors
  • 7.1.1 Section Overview
  • 7.1.2 Growth Drivers
  • 7.1.3 Growth Inhibitors
  • 7.1.4 Driver and Inhibitor Impact Assessment
  • 7.1.5 Analyst Perspective
08Key Company Profiles
  • 8.1 Entegris (CMC Materials)
  • 8.1.1 Company Overview
  • 8.1.2 Key Products & Segments
  • 8.1.3 Financial Performance (2023–2025)
  • 8.1.4 Business Strategy
  • 8.1.5 SWOT Analysis
  • 8.1.6 Strategic Implications (2026–2032)
  • 8.2 Resonac
  • 8.2.1 Company Overview
  • 8.2.2 Key Products & Segments
  • 8.2.3 Financial Performance (2023–2025)
  • 8.2.4 Business Strategy
  • 8.2.5 SWOT Analysis
  • 8.2.6 Strategic Implications (2026–2032)
  • 8.3 Fujimi Incorporated
  • 8.3.1 Company Overview
  • 8.3.2 Key Products & Segments
  • 8.3.3 Financial Performance (2023–2025)
  • 8.3.4 Business Strategy
  • 8.3.5 SWOT Analysis
  • 8.3.6 Strategic Implications (2026–2032)
  • 8.4 Qnity Electronics
  • 8.4.1 Company Overview
  • 8.4.2 Key Products & Segments
  • 8.4.3 Financial Performance (2023–2025)
  • 8.4.4 Business Strategy
  • 8.4.5 SWOT Analysis
  • 8.4.6 Strategic Implications (2026–2032)
  • 8.5 Merck KGaA (Versum Materials)
  • 8.5.1 Company Overview
  • 8.5.2 Key Products & Segments
  • 8.5.3 Financial Performance (2023–2025)
  • 8.5.4 Business Strategy
  • 8.5.5 SWOT Analysis
  • 8.5.6 Strategic Implications (2026–2032)
  • 8.6 Fujifilm
  • 8.6.1 Company Overview
  • 8.6.2 Key Products & Segments
  • 8.6.3 Financial Performance (2023–2025)
  • 8.6.4 Business Strategy
  • 8.6.5 SWOT Analysis
  • 8.6.6 Strategic Implications (2026–2032)
  • 8.7 AGC
  • 8.7.1 Company Overview
  • 8.7.2 Key Products & Segments
  • 8.7.3 Financial Performance (2023–2025)
  • 8.7.4 Business Strategy
  • 8.7.5 SWOT Analysis
  • 8.7.6 Strategic Implications (2026–2032)
  • 8.8 KC Tech
  • 8.8.1 Company Overview
  • 8.8.2 Key Products & Segments
  • 8.8.3 Financial Performance (2023–2025)
  • 8.8.4 Business Strategy
  • 8.8.5 SWOT Analysis
  • 8.8.6 Strategic Implications (2026–2032)
  • 8.9 JSR Corporation
  • 8.9.1 Company Overview
  • 8.9.2 Key Products & Segments
  • 8.9.3 Financial Performance (2023–2025)
  • 8.9.4 Business Strategy
  • 8.9.5 SWOT Analysis
  • 8.9.6 Strategic Implications (2026–2032)
  • 8.10 Anjimirco Shanghai
  • 8.10.1 Company Overview
  • 8.10.2 Key Products & Segments
  • 8.10.3 Financial Performance (2023–2025)
  • 8.10.4 Business Strategy
  • 8.10.5 SWOT Analysis
  • 8.10.6 Strategic Implications (2026–2032)
  • 8.11 Soulbrain
  • 8.11.1 Company Overview
  • 8.11.2 Key Products & Segments
  • 8.11.3 Financial Performance (2023–2025)
  • 8.11.4 Business Strategy
  • 8.11.5 SWOT Analysis
  • 8.11.6 Strategic Implications (2026–2032)
  • 8.12 Saint-Gobain
  • 8.12.1 Company Overview
  • 8.12.2 Key Products & Segments
  • 8.12.3 Financial Performance (2023–2025)
  • 8.12.4 Business Strategy
  • 8.12.5 SWOT Analysis
  • 8.12.6 Strategic Implications (2026–2032)
  • 8.13 Ace Nanochem
  • 8.13.1 Company Overview
  • 8.13.2 Key Products & Segments
  • 8.13.3 Financial Performance (2023–2025)
  • 8.13.4 Business Strategy
  • 8.13.5 SWOT Analysis
  • 8.13.6 Strategic Implications (2026–2032)
  • 8.14 Dongjin Semichem
  • 8.14.1 Company Overview
  • 8.14.2 Key Products & Segments
  • 8.14.3 Financial Performance (2023–2025)
  • 8.14.4 Business Strategy
  • 8.14.5 SWOT Analysis
  • 8.14.6 Strategic Implications (2026–2032)
  • 8.15 Vibrantz (Ferro)
  • 8.15.1 Company Overview
  • 8.15.2 Key Products & Segments
  • 8.15.3 Financial Performance (2023–2025)
  • 8.15.4 Business Strategy
  • 8.15.5 SWOT Analysis
  • 8.15.6 Strategic Implications (2026–2032)
  • 8.16 WEC Group
  • 8.16.1 Company Overview
  • 8.16.2 Key Products & Segments
  • 8.16.3 Financial Performance (2023–2025)
  • 8.16.4 Business Strategy
  • 8.16.5 SWOT Analysis
  • 8.16.6 Strategic Implications (2026–2032)
  • 8.17 SKC (SK Enpulse)
  • 8.17.1 Company Overview
  • 8.17.2 Key Products & Segments
  • 8.17.3 Financial Performance (2023–2025)
  • 8.17.4 Business Strategy
  • 8.17.5 SWOT Analysis
  • 8.17.6 Strategic Implications (2026–2032)
  • 8.18 Shanghai Xinanna Electronic Technology
  • 8.18.1 Company Overview
  • 8.18.2 Key Products & Segments
  • 8.18.3 Financial Performance (2023–2025)
  • 8.18.4 Business Strategy
  • 8.18.5 SWOT Analysis
  • 8.18.6 Strategic Implications (2026–2032)
  • 8.19 Hubei Dinglong
  • 8.19.1 Company Overview
  • 8.19.2 Key Products & Segments
  • 8.19.3 Financial Performance (2023–2025)
  • 8.19.4 Business Strategy
  • 8.19.5 SWOT Analysis
  • 8.19.6 Strategic Implications (2026–2032)
  • 8.20 Samsung SDI
  • 8.20.1 Company Overview
  • 8.20.2 Key Products & Segments
  • 8.20.3 Financial Performance (2023–2025)
  • 8.20.4 Business Strategy
  • 8.20.5 SWOT Analysis
  • 8.20.6 Strategic Implications (2026–2032)
  • 8.21 Fujibo Group
  • 8.21.1 Company Overview
  • 8.21.2 Key Products & Segments
  • 8.21.3 Financial Performance (2023–2025)
  • 8.21.4 Business Strategy
  • 8.21.5 SWOT Analysis
  • 8.21.6 Strategic Implications (2026–2032)
  • 8.22 3M
  • 8.22.1 Company Overview
  • 8.22.2 Key Products & Segments
  • 8.22.3 Financial Performance (2023–2025)
  • 8.22.4 Business Strategy
  • 8.22.5 SWOT Analysis
  • 8.22.6 Strategic Implications (2026–2032)
  • 8.23 FNS TECH
  • 8.23.1 Company Overview
  • 8.23.2 Key Products & Segments
  • 8.23.3 Financial Performance (2023–2025)
  • 8.23.4 Business Strategy
  • 8.23.5 SWOT Analysis
  • 8.23.6 Strategic Implications (2026–2032)
  • 8.24 IVT Technologies Co, Ltd.
  • 8.24.1 Company Overview
  • 8.24.2 Key Products & Segments
  • 8.24.3 Financial Performance (2023–2025)
  • 8.24.4 Business Strategy
  • 8.24.5 SWOT Analysis
  • 8.24.6 Strategic Implications (2026–2032)
  • 8.25 TWI Incorporated
  • 8.25.1 Company Overview
  • 8.25.2 Key Products & Segments
  • 8.25.3 Financial Performance (2023–2025)
  • 8.25.4 Business Strategy
  • 8.25.5 SWOT Analysis
  • 8.25.6 Strategic Implications (2026–2032)
  • 8.26 KPX Chemical
  • 8.26.1 Company Overview
  • 8.26.2 Key Products & Segments
  • 8.26.3 Financial Performance (2023–2025)
  • 8.26.4 Business Strategy
  • 8.26.5 SWOT Analysis
  • 8.26.6 Strategic Implications (2026–2032)
  • 8.27 Engis Corporation
  • 8.27.1 Company Overview
  • 8.27.2 Key Products & Segments
  • 8.27.3 Financial Performance (2023–2025)
  • 8.27.4 Business Strategy
  • 8.27.5 SWOT Analysis
  • 8.27.6 Strategic Implications (2026–2032)
  • 8.28 TOPPAN INFOMEDIA
  • 8.28.1 Company Overview
  • 8.28.2 Key Products & Segments
  • 8.28.3 Financial Performance (2023–2025)
  • 8.28.4 Business Strategy
  • 8.28.5 SWOT Analysis
  • 8.28.6 Strategic Implications (2026–2032)
  • 8.29 CHUANYAN
  • 8.29.1 Company Overview
  • 8.29.2 Key Products & Segments
  • 8.29.3 Financial Performance (2023–2025)
  • 8.29.4 Business Strategy
  • 8.29.5 SWOT Analysis
  • 8.29.6 Strategic Implications (2026–2032)
  • 8.30 Zhuhai Cornerstone Technologies
  • 8.30.1 Company Overview
  • 8.30.2 Key Products & Segments
  • 8.30.3 Financial Performance (2023–2025)
  • 8.30.4 Business Strategy
  • 8.30.5 SWOT Analysis
  • 8.30.6 Strategic Implications (2026–2032)
  • 8.31 Konfoong Materials International
  • 8.31.1 Company Overview
  • 8.31.2 Key Products & Segments
  • 8.31.3 Financial Performance (2023–2025)
  • 8.31.4 Business Strategy
  • 8.31.5 SWOT Analysis
  • 8.31.6 Strategic Implications (2026–2032)
  • 8.32 Tianjin Helen
  • 8.32.1 Company Overview
  • 8.32.2 Key Products & Segments
  • 8.32.3 Financial Performance (2023–2025)
  • 8.32.4 Business Strategy
  • 8.32.5 SWOT Analysis
  • 8.32.6 Strategic Implications (2026–2032)
  • 8.33 Shenzhen Angshite Technology
  • 8.33.1 Company Overview
  • 8.33.2 Key Products & Segments
  • 8.33.3 Financial Performance (2023–2025)
  • 8.33.4 Business Strategy
  • 8.33.5 SWOT Analysis
  • 8.33.6 Strategic Implications (2026–2032)
  • 8.34 Advanced Nano Products Co.,Ltd
  • 8.34.1 Company Overview
  • 8.34.2 Key Products & Segments
  • 8.34.3 Financial Performance (2023–2025)
  • 8.34.4 Business Strategy
  • 8.34.5 SWOT Analysis
  • 8.34.6 Strategic Implications (2026–2032)
  • 8.35 Zhejiang Bolai Narun Electronic Materials
  • 8.35.1 Company Overview
  • 8.35.2 Key Products & Segments
  • 8.35.3 Financial Performance (2023–2025)
  • 8.35.4 Business Strategy
  • 8.35.5 SWOT Analysis
  • 8.35.6 Strategic Implications (2026–2032)
  • 8.36 Dongguan Golden Sun Abrasives
  • 8.36.1 Company Overview
  • 8.36.2 Key Products & Segments
  • 8.36.3 Financial Performance (2023–2025)
  • 8.36.4 Business Strategy
  • 8.36.5 SWOT Analysis
  • 8.36.6 Strategic Implications (2026–2032)
  • 8.37 Shinmicro Materials (Jiaxing)
  • 8.37.1 Company Overview
  • 8.37.2 Key Products & Segments
  • 8.37.3 Financial Performance (2023–2025)
  • 8.37.4 Business Strategy
  • 8.37.5 SWOT Analysis
  • 8.37.6 Strategic Implications (2026–2032)
  • 8.38 Beijing Hangtian Saide
  • 8.38.1 Company Overview
  • 8.38.2 Key Products & Segments
  • 8.38.3 Financial Performance (2023–2025)
  • 8.38.4 Business Strategy
  • 8.38.5 SWOT Analysis
  • 8.38.6 Strategic Implications (2026–2032)
09Competitive Landscape
  • 9.1 Competitive Landscape Overview
  • 9.2 Competitive Intensity Assessment
  • 9.3 Key Player Strategies & Positioning
  • 9.4 Competitive Dynamics & Strategic Outlook
  • 9.4.1 Emerging Competitive Threats
  • 9.4.2 Consolidation vs. Fragmentation Outlook
  • 9.4.3 Competitive Response Matrix
  • 9.4.4 Strategic Recommendations, 2026–2032
10Porter's Five Forces Analysis
  • 10.1 Threat of New Entrants
  • 10.2 Bargaining Power of Buyers
  • 10.3 Bargaining Power of Suppliers
  • 10.4 Threat of Substitutes
  • 10.5 Competitive Rivalry
11PESTLE Analysis
  • 11.1 Political
  • 11.2 Economic
  • 11.3 Social and Demographic
  • 11.4 Technological
  • 11.5 Legal and Regulatory
  • 11.6 Environmental
  • 11.7 Strategic Implications of the PESTLE Assessment
12SWOT Analysis
13Future Trends & Outlook
  • 13.1 Future Trends & Outlook
  • 13.1.1 Trend Summary and Commercial Maturity Assessment
  • 13.1.2 Technology and Innovation Trends
  • 13.1.3 Long-Term Market Outlook
  • 13.1.4 Investment & M&A Activity Outlook
  • 13.1.5 Overall Outlook Assessment

Frequently asked questions

What is the size of the global CMP Slurry and Pads market?
The global CMP Slurry and Pads market is estimated at US$ 3.36 billion in 2025 (base year) and is projected to reach US$ 5.17 billion by 2032.
What is the forecast CAGR for the CMP Slurry and Pads market?
The market is expected to grow at a CAGR of 7.0% from 2026 to 2032, expanding from US$ 3.36 billion in 2025 to US$ 5.17 billion in 2032, roughly 1.5 times its base-year value.
What is CMP Slurry and Pads?
CMP slurries and CMP pads are the core consumable set enabling wafer planarization in IC manufacturing. In CMP, controlled backside pressure brings the wafer front surface into contact with a rotating pad while a chemical-and-abrasive slurry at the interface drives simultaneous chemical reaction and mechanical abrasion to remove overburden and achieve global/local planarity.
How is the CMP Slurry and Pads market segmented by type?
By type, the market is segmented into CMP Slurry and CMP Pads.
Which companies are profiled in the CMP Slurry and Pads market report?
Key players profiled include Entegris (CMC Materials), Resonac, Fujimi Incorporated, Qnity Electronics, Merck KGaA (Versum Materials), Fujifilm, AGC and KC Tech, among 38 companies covered in total.
What geographies does the CMP Slurry and Pads market analysis include?
The market is analysed across Asia Pacific, North America, Europe, Middle East & Africa and Latin America, with 20 country-level markets including China, Japan, United States, Canada, Germany, France, Egypt and South Africa.
What are the key demand drivers for CMP Slurry and Pads?
On the supply side, differentiation is shifting from “headline removal rate” toward “wide process window + low defectivity + stable CoO,” supported by integrated consumables portfolios and closer co-optimization with customers’ roadmaps, alongside a visible push toward localized, cost-competitive, and more resilient supply chains.
What are the main risks and barriers in the CMP Slurry and Pads market?
In practice, these are not “generic” materials: slurry chemistries are engineered by film stack (dielectric/oxide including STI and ILD, tungsten, copper, barrier layers, and emerging metals), while pad platforms are tuned via hardness, pore structure, compressibility, and groove patterns to hit the target removal rate, selectivity, within-wafer non-uniformity, and defectivity for each CMP module.
Who should buy the CMP Slurry and Pads market report?
The report is intended for manufacturers and solution providers, distributors and end users, investors and consultants, and government or industry bodies who need market size, segmentation, competitive and regional data for the CMP Slurry and Pads market.
What license options are available for this report?
The report is available as a Single User License (US$ 3,500, one named user), a Site License (US$ 5,250, up to 10 users) and a Global / Corporate License (US$ 7,000, unlimited users), all delivered in PDF format.

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